Sivers Semiconductors introduces Daybreak chipset to support 5G-Advanced and 6G FR3 deployments in base stations and CPE markets.

Sivers Semiconductors targets seamless satellite handover and flat-antenna terminal design in multi-orbit broadband connectivity.

Sivers and Doosan launch a USD 1.5M program to develop scalable Ka-band ESA panels powered by advanced multi-beam SATCOM BFICs.

Sivers Semiconductors wins a $3M order as Tachyon adopts its TRB02801-based 28GHz antenna modules to advance scalable mmWave FWA deployments from 2026.

Sivers and POET combine DFB laser technology with the Optical Interposer platform to deliver scalable light-engines for next-generation AI datacenter connectivity.

Sivers Semiconductors joins the DIFI Consortium to advance open standards in satellite communications, leveraging its mmWave and RF expertise to support next-generation interoperability.

Sivers Semiconductors and Nisko Projects partner to penetrate Israel’s growing $630M SATCOM and 5G markets with mmWave/RF solutions for defense and telecom applications.

Sivers Semiconductors partners with O-Net Technologies to integrate advanced DFB lasers into next-generation optical modules, driving energy-efficient networking for AI data centers and co-packaged optics.

New wireless solutions enable Sivers to increase market dominance, while delivering greater value to customers by accelerating their time to market.

Sivers Semiconductors has secured $11.6M in funding through the U.S. CHIPS and Science Act for 5G/6G and Electronic Warfare chip development, partnering with BAE Systems, Raytheon, and Ericsson.