28
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TDK News
28
'26
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Microchip News
Radiation-Hardened Multicore RISC-V Processors for Spaceflight Computing
Microchip validated radiation tolerance and initial silicon benchmarks for the PIC64-HPSC architecture to expand onboard autonomous spacecraft processing.
28
'26
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Anduril News
Anduril and Qualcomm to Rebuild American Computer Manufacturing
Beginning with a U.S.-built laptop powered by the Snapdragon X Series platform, BlueChip will establish the manufacturing capabilities and supplier base needed to bring computer production back to America.
28
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Parker News
Parker Chomerics launches reusable thermal gap filler pad
The THERM-A-GAP PAD 30RB delivers 3.0 W/m-K conductivity with excellent rebound for multiple assembly cycles.
28
'26
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STMicroelectronics News
STMicroelectronics Unveils Compact Intelligent Power Modules for Appliances
The SLLIMM series shrinks 600V 3-phase IGBT inverters by 30% for space-constrained motor drives and heat pumps.
26
'26
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TDK News
High Voltage NTC Temperature Sensors for Power Electronics
TDK Corporation expands its NTC temperature sensor portfolio with M704 and M705 probe assemblies, resolving high-voltage insulation and precise thermal monitoring challenges.
23
'26
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STMicroelectronics News
Power System-in-Package GaN Half-Bridge Integration
STMicroelectronics MasterGaN7 integrates 650V half-bridge transistors and stabilized drivers to boost efficiency, frequency, and power density across compact industrial and consumer converters.
22
'26
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Ryder Industries News
Off-the-Shelf Electronic Modules for Embedded Design
Ryder Industries introduces pre-validated radio frequency, audio amplification, and power supply subassemblies to mitigate component shortages and accelerate electromagnetic compatibility testing.
22
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Allegro Micro Systems News
48V Power Integration and Precision Sensors for Humanoid Robots
Allegro MicroSystems introduces a compact power management and spatial tracking portfolio designed to resolve thermal and spatial constraints in autonomous robotic manipulators.
22
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innodisk
