Infineon develops a new processing unit leveraging external LPDDR4 memory to drive dual high-resolution displays without requiring complex system-on-chip platforms.
New thermal imaging camera delivers 1280 × 1024 HD resolution in the compact A-Series platform, providing a straightforward upgrade path for existing research and test environments.
Keysight, University of Glasgow, NPL, and MPI Corporation have demonstrated a continuous 250 GHz on-wafer measurement methodology for sub-terahertz semiconductor research.
Unified Zephyr platform supports TI MCUs, MPUs and wireless devices, enabling code portability, security updates and streamlined development across hardware.
Synopsys has introduced the Autopilot Platform alongside a portfolio of specialized AgentEngineer solutions designed to automate complex, multi-step engineering workflows across the semiconductor and systems design industries.
TDK Corporation highlighted its latest technical components and power architectures for electric vehicles and fast-charging infrastructure at the Electric & Hybrid Vehicle Technology Expo in Detroit, Michigan.