Toshiba Electronic Devices & Storage Corporation releases the DCL32xx00 Series digital isolators to eliminate ground loops in compact industrial equipment.
Microchip expands its SPE portfolio with the LAN8679 and LAN8680 transceivers and the LAN8660X/1X/2X terminal node family to extend network edge connectivity.
Baumer presents compact 5 GigE industrial cameras with high integration flexibility for industrial automation at the Vision 2026 trade show held in Stuttgart from September 29 to October 1, 2026.
Murata begins mass production of 0201-inch three-terminal MLCCs in the LLD series to minimize parasitic inductance in space-constrained mobile electronics.
3D Systems introduces a semiconductor wafer table prototype based on additive manufacturing to optimize thermal control and reduce production lead times.
BOPLA presents innovative enclosure systems such as BoNext and BoVersa as well as transparent film heaters and antennas at electronica in Munich from November 10 to 13, 2026.
The industrial-grade DDR5 8000 RDIMM delivers 8000 MT/s data transfer speeds, 16GB–64GB capacities, and registered ECC architecture to support demanding AI and enterprise-server workloads.