16 {{ "2026-10-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-16T00:00:00+00:00" | date "longDate" }}

TDK News

Multilayer Varistors for Industrial Transient Overvoltage Protection

TDK Corporation expands its surface-mount multilayer varistor family with the X series, solving transient voltage suppression and sustainability challenges in industrial electronics.

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16 {{ "2026-10-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-16T00:00:00+00:00" | date "longDate" }}

Advantech News

Advantech launches AIR-411 edge AI HPC system

The 17-liter workstation integrates Intel Core 200S processors and 300W GPUs for inspection, imaging, and localized LLMs.

Read more…

15 {{ "2026-10-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-15T00:00:00+00:00" | date "longDate" }}

Etel News

Planar Air Bearing Platforms for Semiconductor Step-and-Scan Applications

ETEL introduces a full air bearing planar platform designed to support next-generation maskless lithography and optical inspection within the semiconductor ecosystem.

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15 {{ "2026-10-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-15T00:00:00+00:00" | date "longDate" }}

Microchip News

Radiation-Tolerant GaN Point-of-Load Converters for Space Computing Systems

Microchip Technology has released the POL-05-20S-T point-of-load converter to deliver high-current core power for radiation-exposed processing platforms.

Read more…

15 {{ "2026-10-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-15T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Introduces PCIe 7.0 Protocol Test Solution

Instant link-up and deep protocol visibility reduce risk and shorten next generation system development.

Read more…

15 {{ "2026-10-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-15T00:00:00+00:00" | date "longDate" }}

Bodewell Group News

Scaling Through-Glass Via Metallization for Panel-Level Packaging

VON ARDENNE expands semiconductor deposition to panel-level packaging using high-power impulse magnetron sputtering on its HISS platform to resolve through-glass via metallization limits.

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14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

ZEISS News

Advanced Packaging Solutions for X-Ray Inspection and Warpage Correction

ZEISS is expanding its semiconductor manufacturing portfolio with new metrology equipment designed to address process control challenges in high-density chiplet architectures.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

TDK News

Dual-Die Magnetic Motor Position Sensors for ASIL D By-Wire Applications

TDK introduces Micronas HAR 3025 with stray-field compensation to ensure fail-operational commutation in redundant automotive actuators.

Read more…

14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-14T00:00:00+00:00" | date "longDate" }}

Toshiba News

Compact Low-Voltage eFuse ICs

Toshiba Electronic Devices and Storage Corporation introduces the TCKE5 Series of low-voltage eFuse ICs, protecting compact industrial rails and portable electronics from overcurrent and short-circuit faults.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Kontron News

Localized Manufacturing of Rugged 3U VPX Defense Computing Platforms

Kontron transitions its defense electronics supply chain to a build-to-stock model in Alabama to accelerate hardware delivery for tactical edge applications.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Multilayer Varistors for Industrial Transient Overvoltage Protection

TDK Corporation expands its surface-mount multilayer varistor family with the X series, solving transient voltage suppression and sustainability challenges in industrial electronics.

Advantech launches AIR-411 edge AI HPC system

The 17-liter workstation integrates Intel Core 200S processors and 300W GPUs for inspection, imaging, and localized LLMs.

Planar Air Bearing Platforms for Semiconductor Step-and-Scan Applications

ETEL introduces a full air bearing planar platform designed to support next-generation maskless lithography and optical inspection within the semiconductor ecosystem.

Radiation-Tolerant GaN Point-of-Load Converters for Space Computing Systems

Microchip Technology has released the POL-05-20S-T point-of-load converter to deliver high-current core power for radiation-exposed processing platforms.

Keysight Introduces PCIe 7.0 Protocol Test Solution

Instant link-up and deep protocol visibility reduce risk and shorten next generation system development.

Scaling Through-Glass Via Metallization for Panel-Level Packaging

VON ARDENNE expands semiconductor deposition to panel-level packaging using high-power impulse magnetron sputtering on its HISS platform to resolve through-glass via metallization limits.

Advanced Packaging Solutions for X-Ray Inspection and Warpage Correction

ZEISS is expanding its semiconductor manufacturing portfolio with new metrology equipment designed to address process control challenges in high-density chiplet architectures.

Dual-Die Magnetic Motor Position Sensors for ASIL D By-Wire Applications

TDK introduces Micronas HAR 3025 with stray-field compensation to ensure fail-operational commutation in redundant automotive actuators.

Compact Low-Voltage eFuse ICs

Toshiba Electronic Devices and Storage Corporation introduces the TCKE5 Series of low-voltage eFuse ICs, protecting compact industrial rails and portable electronics from overcurrent and short-circuit faults.

Localized Manufacturing of Rugged 3U VPX Defense Computing Platforms

Kontron transitions its defense electronics supply chain to a build-to-stock model in Alabama to accelerate hardware delivery for tactical edge applications.

International