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STMicroelectronics News
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Fraunhofer News
Fraunhofer IPMS Develops 5,040 PPI Full-Color OLED Microdisplay
28 nm CMOS technology combines 2.52 µm subpixels and flexible driving modes for efficient AR, VR devices, showcased at Eurodisplay 2026.
21
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BAE SYSTEMS News
Development of 45-Nanometer Radiation-Hardened Space Microelectronics
BAE Systems and GlobalFoundries are collaborating to manufacture custom application-specific integrated circuits for space-grade digital infrastructure.
21
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Nordson Test & Inspection News
Semiconductor Acoustic Inspection and X-Ray Metrology
Nordson introduces advanced acoustic and X-ray systems to enhance defect detection, process control, and throughput across the semiconductor data ecosystem.
19
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Infineon News
Acquisition of Semiconductor Memory Business Supports Portfolio Optimization
Infineon sells NOR Flash and F-RAM assets to Winbond for $1.12 billion to concentrate resources on primary growth markets.
17
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Melexis News
Integrated Current Sensors Expand Automotive Power Measurement
Melexis introduces the MLX91224 and MLX91225 isolated current sensor platform, delivering plug-and-play measurement up to 100 ARMS for electric vehicle powertrains, chargers, and industrial power systems.
17
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Harman News
HARMAN Joins SDVerse Marketplace
HARMAN joins the SDVerse B2B marketplace to provide automakers with expanded access to software-defined vehicle products and engineering solutions.
17
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TME News
Global Expansion of Electronic Component Logistics
Transfer Multisort Elektronik Sp. z o.o. presents international growth strategies and automated distribution infrastructure at Electronica 2026.
17
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ONSEMI News
onsemi Introduces Embedded Power Platform for Higher Power Density
Silicon wafer packaging integrates multiple dies and optimizes electrical, thermal and mechanical performance for AI infrastructure, electric vehicles and industrial applications.
17
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Samsung News
