10 {{ "2026-09-10T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-10T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Fraunhofer IPMS Develops MEMS Spatial Light Modulators

Fraunhofer IPMS will present microelectromechanical spatial light modulators (SLMs) and customer evaluation kits for high-speed photonic applications at Photonix Japan 2026.

Read more…

09 {{ "2026-09-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-09T00:00:00+00:00" | date "longDate" }}

Anritsu News

High-Speed Test Solutions for AI Infrastructure

Anritsu demonstrates advanced test and measurement solutions at ECOC 2026 in Malaga, Spain, to validate high-speed optical and digital networks for artificial intelligence applications.

Read more…

09 {{ "2026-09-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-09T00:00:00+00:00" | date "longDate" }}

TDK News

TDK Launches 10 μF 100 V Soft-Termination X7R MLCC for 48 V Systems

New 3225-format capacitors combine low ESR, high capacitance and AEC-Q200 qualification for AI servers, humanoid robots, xEVs and industrial equipment.

Read more…

09 {{ "2026-09-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-09T00:00:00+00:00" | date "longDate" }}

ARROW News

Arrow Enables Remote Evaluation of NXP Ara240 Edge AI Accelerator

Digital Test Drive gives engineers hands-on access to AI workloads for computer vision, generative AI and multimodal edge applications before hardware investment.

Read more…

08 {{ "2026-09-08T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-08T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Integration of advanced battery management systems

STMicroelectronics collaborates with industrial manufacturers to deploy precision lithium-battery management integrated circuits for portable equipment.

Read more…

08 {{ "2026-09-08T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-08T00:00:00+00:00" | date "longDate" }}

Wernerwirth News

Reliability in Electronics Manufacturing

WERNER WIRTH, alongside its partners, is developing integrated solutions for connection technology and component protection at electronica 2026 in Munich to realize the All Electric Society.

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04 {{ "2026-09-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-04T00:00:00+00:00" | date "longDate" }}

Siemens News

NanoBridge Adopts Siemens FPGA Synthesis for Advanced Semiconductor Development

Optimized design workflows support low-power, harsh-environment FPGA devices for aerospace, automotive and critical infrastructure applications.

Read more…

04 {{ "2026-09-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-04T00:00:00+00:00" | date "longDate" }}

Anritsu News

Verification of Rel-17 Coverage Enhancements for 5G Network Infrastructure

Anritsu and MediaTek have validated new protocol conformance testcases to ensure reliable multi-slot uplink data transmission in weak signal environments.

Read more…

04 {{ "2026-09-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-04T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight to Showcase Expanded PNT Capabilities at ION GNSS+ 2026

Keysight experts will show how intelligent insights and advanced test solutions can reduce development risk, accelerate validation, and speed time-to-market.

Read more…

03 {{ "2026-09-03T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-03T00:00:00+00:00" | date "longDate" }}

Trumpf News

Ionized Sputtering for Glass Substrate Packaging

TRUMPF introduces an industrial plasma generation process designed to coat high-density through-glass vias, facilitating rapid data transmission in artificial intelligence processors.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Fraunhofer IPMS Develops MEMS Spatial Light Modulators

Fraunhofer IPMS will present microelectromechanical spatial light modulators (SLMs) and customer evaluation kits for high-speed photonic applications at Photonix Japan 2026.

High-Speed Test Solutions for AI Infrastructure

Anritsu demonstrates advanced test and measurement solutions at ECOC 2026 in Malaga, Spain, to validate high-speed optical and digital networks for artificial intelligence applications.

TDK Launches 10 μF 100 V Soft-Termination X7R MLCC for 48 V Systems

New 3225-format capacitors combine low ESR, high capacitance and AEC-Q200 qualification for AI servers, humanoid robots, xEVs and industrial equipment.

Arrow Enables Remote Evaluation of NXP Ara240 Edge AI Accelerator

Digital Test Drive gives engineers hands-on access to AI workloads for computer vision, generative AI and multimodal edge applications before hardware investment.

Integration of advanced battery management systems

STMicroelectronics collaborates with industrial manufacturers to deploy precision lithium-battery management integrated circuits for portable equipment.

Reliability in Electronics Manufacturing

WERNER WIRTH, alongside its partners, is developing integrated solutions for connection technology and component protection at electronica 2026 in Munich to realize the All Electric Society.

NanoBridge Adopts Siemens FPGA Synthesis for Advanced Semiconductor Development

Optimized design workflows support low-power, harsh-environment FPGA devices for aerospace, automotive and critical infrastructure applications.

Verification of Rel-17 Coverage Enhancements for 5G Network Infrastructure

Anritsu and MediaTek have validated new protocol conformance testcases to ensure reliable multi-slot uplink data transmission in weak signal environments.

Keysight to Showcase Expanded PNT Capabilities at ION GNSS+ 2026

Keysight experts will show how intelligent insights and advanced test solutions can reduce development risk, accelerate validation, and speed time-to-market.

Ionized Sputtering for Glass Substrate Packaging

TRUMPF introduces an industrial plasma generation process designed to coat high-density through-glass vias, facilitating rapid data transmission in artificial intelligence processors.

International