Integrated AI acceleration, graphics and industrial computing enable faster inference, simplified integration and scalable intelligent automation across demanding edge applications.
SECO introduces a standardized system-on-module designed to bridge rapid developer prototyping with full-scale industrial integration for advanced robotics and machine vision workflows.
Lane Electronics provides a range of low-weight, vibration-resistant electrical connectors engineered to support the demanding hardware requirements of autonomous drone platforms.
The new 2U edge AI system enables rapid deployment of private LLMs, AI agents, RAG applications, and intelligent automation with enterprise-grade performance in a compact on-premises platform.
AttoTude has reduced its design cycles by more than 50% while achieving first-pass silicon success across advanced RF, sub-THz, and THz tape-outs that underpin its guided-wave interconnect platform.
Aetina expands edge AI capabilities with NVIDIA Jetson Orin Nano 2, enabling higher-performance generative AI and multimodal inference for compact Physical AI systems.
IDS Imaging has commenced series production of its NION 3D Time-of-Flight camera, delivering precise real-time depth sensing for automation, robotics, logistics, and industrial vision applications.