03 {{ "2026-09-03T00:00:00+00:00" | date "MMM" }} '26

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Würth Elektronik News

High-Speed Optocoupler WL-OCHS for Digital Signal Transmission

Würth Elektronik presents the high-speed optocoupler WL-OCHS for secure, galvanically isolated signal transmission in interference-prone industrial and medical applications.

Read more…

03 {{ "2026-09-03T00:00:00+00:00" | date "MMM" }} '26

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Seco News

SECO Industrial HMI and SBC Dragonwing IQ-2390

SECO introduces the Compact Vision 5 Dragonwing IQ-2390 HMI and SBC-Dragonwing-IQ-2390 to modernize compact embedded industrial systems with on-device AI.

Read more…

02 {{ "2026-09-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-02T00:00:00+00:00" | date "longDate" }}

Rutronik News

Rutronik & Nanopower Partner to Expand Ultra-Low-Power IoT Portfolio

Nanoampere-range power-saving ICs support energy-autonomous sensors, extending battery life and enabling battery-free designs across connected applications.

Read more…

02 {{ "2026-09-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-02T00:00:00+00:00" | date "longDate" }}

Trumpf News

TRUMPF Showcases Integrated AI Chip Cooling Technology at Semicon Taiwan 2026

Ultrashort-pulse lasers create microscopic cooling structures directly within chip stacks, addressing heat dissipation challenges in advanced semiconductor packaging.

Read more…

02 {{ "2026-09-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-02T00:00:00+00:00" | date "longDate" }}

Alps Alpine News

Electromechanical Switches for Advanced Vehicle Energy Networks

Alps Alpine introduces a new detection component designed to handle elevated power loads and simplify circuit layouts in electrified transportation platforms.

Read more…

02 {{ "2026-09-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-02T00:00:00+00:00" | date "longDate" }}

Renishaw News

Renishaw launches next-generation RLE interferometric laser encoders

The new product range comprises three systems providing precision position feedback for a wide range of semiconductor manufacturing motion control applications.

Read more…

01 {{ "2026-09-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-01T00:00:00+00:00" | date "longDate" }}

Infineon News

Radiation-Hardened Semiconductors for Space Telescopes

Infineon provides radiation-resistant power infrastructure for the NASA Roman Space Telescope to ensure stable energy distribution at the second Sun-Earth Lagrange point.

Read more…

01 {{ "2026-09-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-01T00:00:00+00:00" | date "longDate" }}

Mediatek News

NVIDIA and MediaTek Deepen Alliance Across AI, PC, and Automotive

MediaTek to Adopt New NVIDIA NVLink Fusion Platform, Helping Customers Take Custom XPUs to NVIDIA NVLink-Connected, Rack-Scale AI Factories.

Read more…

01 {{ "2026-09-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-01T00:00:00+00:00" | date "longDate" }}

Qualcomm News

Qualcomm and HUMAIN Unveil Horizon Ultra AI PC at LEAP 2026

Horizon Ultra is the new flagship of the HUMAIN Horizon line bringing CPU, GPU and NPU computing together for on-device AI and launching first with Microsoft Windows.

Read more…

01 {{ "2026-09-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-01T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Announces VMware AI Factory

New AI Infrastructure Automation and Private AI Services Deliver a Single Consistent Environment for Deploying, Governing, and Securing AI Workloads from Bare Metal to Inference.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

High-Speed Optocoupler WL-OCHS for Digital Signal Transmission

Würth Elektronik presents the high-speed optocoupler WL-OCHS for secure, galvanically isolated signal transmission in interference-prone industrial and medical applications.

SECO Industrial HMI and SBC Dragonwing IQ-2390

SECO introduces the Compact Vision 5 Dragonwing IQ-2390 HMI and SBC-Dragonwing-IQ-2390 to modernize compact embedded industrial systems with on-device AI.

Rutronik & Nanopower Partner to Expand Ultra-Low-Power IoT Portfolio

Nanoampere-range power-saving ICs support energy-autonomous sensors, extending battery life and enabling battery-free designs across connected applications.

TRUMPF Showcases Integrated AI Chip Cooling Technology at Semicon Taiwan 2026

Ultrashort-pulse lasers create microscopic cooling structures directly within chip stacks, addressing heat dissipation challenges in advanced semiconductor packaging.

Electromechanical Switches for Advanced Vehicle Energy Networks

Alps Alpine introduces a new detection component designed to handle elevated power loads and simplify circuit layouts in electrified transportation platforms.

Renishaw launches next-generation RLE interferometric laser encoders

The new product range comprises three systems providing precision position feedback for a wide range of semiconductor manufacturing motion control applications.

Radiation-Hardened Semiconductors for Space Telescopes

Infineon provides radiation-resistant power infrastructure for the NASA Roman Space Telescope to ensure stable energy distribution at the second Sun-Earth Lagrange point.

NVIDIA and MediaTek Deepen Alliance Across AI, PC, and Automotive

MediaTek to Adopt New NVIDIA NVLink Fusion Platform, Helping Customers Take Custom XPUs to NVIDIA NVLink-Connected, Rack-Scale AI Factories.

Qualcomm and HUMAIN Unveil Horizon Ultra AI PC at LEAP 2026

Horizon Ultra is the new flagship of the HUMAIN Horizon line bringing CPU, GPU and NPU computing together for on-device AI and launching first with Microsoft Windows.

Broadcom Announces VMware AI Factory

New AI Infrastructure Automation and Private AI Services Deliver a Single Consistent Environment for Deploying, Governing, and Securing AI Workloads from Bare Metal to Inference.

International