Bopla News

Founded in 1970 and based in Bünde, Germany, BOPLA Gehäuse Systeme develops and manufactures electronic enclosures and input solutions for industrial electronics. Its portfolio includes plastic and aluminium enclosures, HMI systems, membrane keypads, touchscreens and customised housing solutions, supported by machining, printing, assembly and integration services. BOPLA combines enclosure engineering with application-specific customisation to protect and operate electronic equipment in demanding environments. Part of the Phoenix Mecano Group, the company serves customers internationally across automation, mechanical engineering, measurement and control, medical technology, building systems and other electronics-intensive industries.

www.bopla.de

30 SEP '26

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Technical Enclosure Solutions and Printed Electronics at electronica 2026

BOPLA presents innovative enclosure systems such as BoNext and BoVersa as well as transparent film heaters and antennas at electronica in Munich from November 10 to 13, 2026.

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20 OCT '25

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BOPLA Introduces BoVersa Enclosure for Wireless and Embedded Systems

BOPLA introduces the BoVersa enclosure combining modular design, IP66/IP68 protection, and aluminum cooling fins for efficient wireless and embedded electronic systems.

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Technical Enclosure Solutions and Printed Electronics at electronica 2026

BOPLA presents innovative enclosure systems such as BoNext and BoVersa as well as transparent film heaters and antennas at electronica in Munich from November 10 to 13, 2026.

BOPLA Introduces BoVersa Enclosure for Wireless and Embedded Systems

BOPLA introduces the BoVersa enclosure combining modular design, IP66/IP68 protection, and aluminum cooling fins for efficient wireless and embedded electronic systems.

International