Featuring Sony’s Altair ALT1350 chipset, the Telit Cinterion ME310M1-W1 is certified by two major U.S. MNOs, opening new possibilities for LTE-M IoT deployments.
The new XPPC 16-10N97 and XPPC 10-10N97 feature Intel processors for robust performance, fanless designs for silent operation, 16:9 widescreens, and diverse I/O connectivity.
Infineon Technologies AG and Flex, a diversified global manufacturer and Infineon's new preferred automotive design partner, are showcasing the new Flex Modular Zone Controller design platform for software-defined vehicles at CES 2025.
The companies announced a licensing agreement to enhance scalable, high-performance optical connectivity with reduced maintenance for next-generation data centers and advanced networks.
NeuroBlade has partnered with Amazon EC2 F2 instances, powered by AMD FPGA and EPYC CPU technologies, to enhance performance and efficiency in cloud-native data analytics workloads.
The All Big Core CPU is paired with a powerful NPU to accelerate Gen-AI tasks, along with MediaTek’s new Dimensity Agentic AI Engine (DAE) that turns traditional AI applications into sophisticated agentic AI applications.
Alan Mayer joins test equipment services leader Electro Rent, leveraging a best-in-class go-to-market strategy and customer success background to drive growth.
In this article, Almir Jakupovic, Sales Director at norelem, discusses how modular clamping systems are revolutionizing precision in metrology, providing engineers with an adaptable, efficient and sustainable solution to meet the demands of high-precision industries.