Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

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Rohde & Schwarz

Rohde & Schwarz presents photonics-based ultra-stable tunable THz system for 6G at EuMW 2024

With the proof-of-concept for a system for 6G wireless data transmission based on a photonic THz communications link, Rohde & Schwarz is showcasing its contribution to state-of-the-art research for next generation wireless technologies at European Microwave Week in Paris. The ultra-stable, tunable THz system, developed within the 6G-ADLANTIK project, is based on frequency comb technology and enables carrier frequencies well beyond 500 GHz.

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19 {{ "2024-09-19T00:00:00+00:00" | date "MMM" }} '24

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Keysight technologies News

Keysight Introduces Quantum Circuit Simulation

Google Quantum AI, Keysight joined forces in the First Circuit Environment with Frequency-Domain Flux Quantization.

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18 {{ "2024-09-18T00:00:00+00:00" | date "MMM" }} '24

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STMicroelectronics News

STMicroelectronics Launches First FIPS 140-3 Certified TPMs for Computing and Embedded Systems

State-of-the-art protection certified to latest standard for information security certification, globally recognized and mandatory for US federal procurement.

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18 {{ "2024-09-18T00:00:00+00:00" | date "MMM" }} '24

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TDK News

TDK presents PoDL daughter cards for Analog Devices’ SPE evaluation boards

TDK Corporation announces a series of 10BASE-T1L plug-and-play test boards, called EVB-DLA-00x.

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17 {{ "2024-09-17T00:00:00+00:00" | date "MMM" }} '24

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Intel News

Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing

Intel to Produce Custom AI Fabric Chip on Intel 18A and Custom Xeon 6 Chip on Intel 3 for AWS; Multi-Year, Multi-Billion-Dollar Collaboration Accelerates Development of Chip Manufacturing in Ohio.

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17 {{ "2024-09-17T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon introduces the XENSIV™ PAS CO2 5V sensor for higher energy efficiency and improved air quality in buildings

In order to further drive decarbonization, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions.

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17 {{ "2024-09-17T00:00:00+00:00" | date "MMM" }} '24

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Vishay News

Vishay Intertechnology Expands Inductor Product Line

Vishay adds more size variations, ensuring that customers can find suitable inductors for any available PCB space.

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17 {{ "2024-09-17T00:00:00+00:00" | date "MMM" }} '24

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Alliance Memory News

Alliance Memory's New 16Gb LPDDR4X SDRAM Delivers High Performance and Efficiency

Alliance Memory introduces a new 16Gb LPDDR4X device, offering high-speed CMOS mobile low-power SDRAMs with increased clock speeds and data rates in a 200-ball FBGA package.

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17 {{ "2024-09-17T00:00:00+00:00" | date "MMM" }} '24

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Toshiba News

Toshiba introduces automotive photocoupler with output withstand voltage of 900V (min)

TLX9152M enables carmakers to replace mechanical relays for high-voltage isolation in EV powertrains and facilitates BMS monitoring.

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16 {{ "2024-09-16T00:00:00+00:00" | date "MMM" }} '24

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Landi Renzo S.p.A.

Landi Renzo Group makes its debut at IAA Transportation

Landi Renzo Group, a global leader in components for natural gas and hydrogen pressure management in the Mobility and Infrastructure sectors, will make its first appearance at the prestigious IAA Transportation trade fair to be held in Hannover from 17 to 22 September. Its presence marks a significant milestone for the Group, demonstrating its commitment to partner with the leading international LCV, MD, and Heavy Duty manufacturers on the common path of energy transition and decarbonisation. Taking part in this event will not only allow the brand to showcase some of the main Hydrogen and Natural Gas products, but it will also be an opportunity to support manufacturers in the development of ad hoc solutions for industrial and commercial mobility.

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International