08 {{ "2024-02-08T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon and Worksport collaborate to reduce weight and cost of portable power stations with GaN

Infineon Technologies AG has announced a collaboration with Worksport Ltd. Worksport will use Infineon’s GaN power semiconductors GS-065-060-5-B-A in the converters for its portable power stations to increase efficiency and power density.

Read more…

08 {{ "2024-02-08T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-08T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

Toward the metaverse: Rohde & Schwarz and Slalom join forces to realize 5G-enabled AR-animated avatar calls

The metaverse and extended reality (XR) applications are considered critical to unlocking the full consumer potential of the 5G technology. Rigorous testing is crucial to ensure the performance and market acceptance of these immersive experiences.

Read more…

08 {{ "2024-02-08T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-08T00:00:00+00:00" | date "longDate" }}

Semiqon News

SemiQon and CMC Microsystems collaboration to accelerate development and access to quantum computing with silicon-based processors

Fully tested silicon-based chips are now shipping to partners for scalable and manufacturable quantum computer projects in the UK, United States, Finland, and Germany.

Read more…

08 {{ "2024-02-08T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-08T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron signs 3 major railway contracts worth exceeding EUR 100m

Kontron announces contract wins in Ireland, Austria, and Slovenia worth exceeding EUR 100m.

Read more…

08 {{ "2024-02-08T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-08T00:00:00+00:00" | date "longDate" }}

AMD News

AMD UNVEILS EMBEDDED+ ARCHITECTURE

AMD-validated solutions provide a simplified path to AI inferencing, sensor fusion, industrial networking, control, and visualization for ODM partners.

Read more…

07 {{ "2024-02-07T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-07T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon and VMAX intensify collaboration for energy-efficient and cost-effective fast charging of electric vehicles

VMAX a leading Chinese manufacturer of power electronics and motor drives for new energy vehicles, has selected the new CoolSiC™ hybrid discrete with TRENCHSTOP™ 5 Fast-Switching IGBT and CoolSiC Schottky Diode from Infineon or its next generation 6.6 kW OBC/DCDC on-board chargers.

Read more…

07 {{ "2024-02-07T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-07T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Enhances Network Master™ Pro MT1040A to Provide Support of OpenZR+

Enables accurate evaluation of a network using OpenZR+ transceivers with excellent cooling performance of the measurement module.

Read more…

07 {{ "2024-02-07T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-07T00:00:00+00:00" | date "longDate" }}

U Blox News

u-blox introduces new LTE-M modules with integrated GNSS to boost industrial connectivity

The SARA-R52 and LEXI-R52 series powered by the 2nd generation of the UBX-R5 chip, optimize cost and performance, while eliminating the need for extra components.

Read more…

07 {{ "2024-02-07T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-07T00:00:00+00:00" | date "longDate" }}

Allegro Micro Systems News

ALLEGRO MICROSYSTEMS INTRODUCES HIGH-BANDWIDTH CURRENT SENSOR TECHNOLOGIES

Power-dense sensors are designed to minimize energy loss while improving efficiency and reliability for SiC and GaN technologies.

Read more…

06 {{ "2024-02-06T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-06T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

Rohde & Schwarz presents its Wi-Fi 7 multi-channel single-box test solutions for R&D and production at MWC 2024

As 5G technology evolves, non-3GPP networks such as public, home and enterprise WLAN hotspots will be more and more interlinked with the 5G core. As a result, tomorrow’s smartphones will rely even more on the next generations of WLAN technology, which will be more powerful and efficient, but also more complex.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Infineon and Worksport collaborate to reduce weight and cost of portable power stations with GaN

Infineon Technologies AG has announced a collaboration with Worksport Ltd. Worksport will use Infineon’s GaN power semiconductors GS-065-060-5-B-A in the converters for its portable power stations to increase efficiency and power density.

Toward the metaverse: Rohde & Schwarz and Slalom join forces to realize 5G-enabled AR-animated avatar calls

The metaverse and extended reality (XR) applications are considered critical to unlocking the full consumer potential of the 5G technology. Rigorous testing is crucial to ensure the performance and market acceptance of these immersive experiences.

SemiQon and CMC Microsystems collaboration to accelerate development and access to quantum computing with silicon-based processors

Fully tested silicon-based chips are now shipping to partners for scalable and manufacturable quantum computer projects in the UK, United States, Finland, and Germany.

Kontron signs 3 major railway contracts worth exceeding EUR 100m

Kontron announces contract wins in Ireland, Austria, and Slovenia worth exceeding EUR 100m.

AMD UNVEILS EMBEDDED+ ARCHITECTURE

AMD-validated solutions provide a simplified path to AI inferencing, sensor fusion, industrial networking, control, and visualization for ODM partners.

Infineon and VMAX intensify collaboration for energy-efficient and cost-effective fast charging of electric vehicles

VMAX a leading Chinese manufacturer of power electronics and motor drives for new energy vehicles, has selected the new CoolSiC™ hybrid discrete with TRENCHSTOP™ 5 Fast-Switching IGBT and CoolSiC Schottky Diode from Infineon or its next generation 6.6 kW OBC/DCDC on-board chargers.

Anritsu Enhances Network Master™ Pro MT1040A to Provide Support of OpenZR+

Enables accurate evaluation of a network using OpenZR+ transceivers with excellent cooling performance of the measurement module.

u-blox introduces new LTE-M modules with integrated GNSS to boost industrial connectivity

The SARA-R52 and LEXI-R52 series powered by the 2nd generation of the UBX-R5 chip, optimize cost and performance, while eliminating the need for extra components.

ALLEGRO MICROSYSTEMS INTRODUCES HIGH-BANDWIDTH CURRENT SENSOR TECHNOLOGIES

Power-dense sensors are designed to minimize energy loss while improving efficiency and reliability for SiC and GaN technologies.

Rohde & Schwarz presents its Wi-Fi 7 multi-channel single-box test solutions for R&D and production at MWC 2024

International