12 {{ "2023-09-12T00:00:00+00:00" | date "MMM" }} '23

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ams OSRAM News

Malaysian Investment Development Authority (MIDA) and ams OSRAM continue mutual support for advanced LED manufacturing in Malaysia

ams OSRAM, a global leader in intelligent sensing and emitting, and the Malaysian Investment Development Authority (MIDA) announce mutual support for the continued investment and expansion in Malaysia. Through a Collaborative Agreement, MIDA demonstrates significant support for ams OSRAM’s initiatives in Malaysia.

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11 {{ "2023-09-11T00:00:00+00:00" | date "MMM" }} '23

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Mouser News

Würth Elektronik has introduced its WSEN-ISDS 6-Axis Inertial Measurement Unit for Drone and Robotic Applications at Mouser

The WSEN-ISDS IMU is a 16-bit digital ultra-low power and high-performance sensor featuring a 3-axis accelerometer and a 3-axis s gyroscope, with selectable measuring ranges and data rates.

Read more…

11 {{ "2023-09-11T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-11T00:00:00+00:00" | date "longDate" }}

TDK News

TDK LAUNCHES NEW AU WIRE BOND-OPTIONAL NTC THERMISTORS FOR LASER DIODE TEMPERATURE MEASUREMENT

These bondable NTC thermistors can be mounted with Au wire bonding inside the package for highly accurate temperature detection of laser diodes (LDs) used for optical communication.

Read more…

09 {{ "2023-09-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-09T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba introduces 600V-rated intelligent power devices for BLDC motor drive

New devices will significantly contribute to miniaturization in space-critical applications.

Read more…

09 {{ "2023-09-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-09T00:00:00+00:00" | date "longDate" }}

Pickering News

Pickering Interfaces will showcase EV BMS test rig at The Battery Show North America 2023 in Novi, Michigan

Pickering Interfaces will showcase its Battery Management System (BMS) test demo at booth #2749 at The Battery Show North America 2023 in Novi, Michigan, USA from 12-14 September 2023.

Read more…

09 {{ "2023-09-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-09T00:00:00+00:00" | date "longDate" }}

Rutronik Info

Rutronik introduces MLCCs from KEMET using KONNEKTTM technology, offering a unique composition with special conductivity

KEMET's KONNEKTTM technology enables the connection of multiple MLCCs to a single surface-mountable component, reducing equivalent series resistance, equivalent series inductance, and thermal resistance of capacitors without a metal frame.

Read more…

09 {{ "2023-09-09T00:00:00+00:00" | date "MMM" }} '23

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Emergent Vision Technologies News

Emergent Vision Technologies eCapture Pro Software Now Supports GPUDirect H.265/H.264, and RTMP Streaming

Emergent Vision Technologies, announces that its eCapture Pro software now supports GPUDirect, H.265 and H.264 video codecs, and RTMP (real-time messaging protocol) streaming.

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08 {{ "2023-09-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-08T00:00:00+00:00" | date "longDate" }}

iBASE News

Low-Power IB838 Single Board Computer Powered by Intel Core i3 N-series Processor

IBASE Technology Inc, introduces the low-power IB838 3.5" single board computer, powered by the Intel^® Core i3 N-series processor.

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08 {{ "2023-09-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-08T00:00:00+00:00" | date "longDate" }}

Congatec News

Congatec COM Express modules receive IEC-60068 railway certification

This certification qualifies these modules for operation in railway applications, confirming that they meet the requirements for extreme conditions such as extended temperatures, rapid temperature changes, shocks, and vibrations.

Read more…

08 {{ "2023-09-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-08T00:00:00+00:00" | date "longDate" }}

Mediatek News

MEDIATEK SUCCESSFULLY DEVELOPS FIRST CHIP USING TSMC'S 3NM PROCESS

MediaTek and TSMC are taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Malaysian Investment Development Authority (MIDA) and ams OSRAM continue mutual support for advanced LED manufacturing in Malaysia

Würth Elektronik has introduced its WSEN-ISDS 6-Axis Inertial Measurement Unit for Drone and Robotic Applications at Mouser

The WSEN-ISDS IMU is a 16-bit digital ultra-low power and high-performance sensor featuring a 3-axis accelerometer and a 3-axis s gyroscope, with selectable measuring ranges and data rates.

TDK LAUNCHES NEW AU WIRE BOND-OPTIONAL NTC THERMISTORS FOR LASER DIODE TEMPERATURE MEASUREMENT

These bondable NTC thermistors can be mounted with Au wire bonding inside the package for highly accurate temperature detection of laser diodes (LDs) used for optical communication.

Toshiba introduces 600V-rated intelligent power devices for BLDC motor drive

New devices will significantly contribute to miniaturization in space-critical applications.

Pickering Interfaces will showcase EV BMS test rig at The Battery Show North America 2023 in Novi, Michigan

Pickering Interfaces will showcase its Battery Management System (BMS) test demo at booth #2749 at The Battery Show North America 2023 in Novi, Michigan, USA from 12-14 September 2023.

Rutronik introduces MLCCs from KEMET using KONNEKTTM technology, offering a unique composition with special conductivity

KEMET's KONNEKTTM technology enables the connection of multiple MLCCs to a single surface-mountable component, reducing equivalent series resistance, equivalent series inductance, and thermal resistance of capacitors without a metal frame.

Emergent Vision Technologies eCapture Pro Software Now Supports GPUDirect H.265/H.264, and RTMP Streaming

Emergent Vision Technologies, announces that its eCapture Pro software now supports GPUDirect, H.265 and H.264 video codecs, and RTMP (real-time messaging protocol) streaming.

Low-Power IB838 Single Board Computer Powered by Intel Core i3 N-series Processor

IBASE Technology Inc, introduces the low-power IB838 3.5" single board computer, powered by the Intel^® Core i3 N-series processor.

Congatec COM Express modules receive IEC-60068 railway certification

This certification qualifies these modules for operation in railway applications, confirming that they meet the requirements for extreme conditions such as extended temperatures, rapid temperature changes, shocks, and vibrations.

MEDIATEK SUCCESSFULLY DEVELOPS FIRST CHIP USING TSMC'S 3NM PROCESS

MediaTek and TSMC are taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.

International

Market Overview

Technical Articles

Case studies

The WSEN-ISDS IMU is a 16-bit digital ultra-low power and high-performance sensor featuring a 3-axis accelerometer and a 3-axis s gyroscope, with selectable measuring ranges and data rates.

These bondable NTC thermistors can be mounted with Au wire bonding inside the package for highly accurate temperature detection of laser diodes (LDs) used for optical communication.

New devices will significantly contribute to miniaturization in space-critical applications.

Pickering Interfaces will showcase its Battery Management System (BMS) test demo at booth #2749 at The Battery Show North America 2023 in Novi, Michigan, USA from 12-14 September 2023.

KEMET's KONNEKTTM technology enables the connection of multiple MLCCs to a single surface-mountable component, reducing equivalent series resistance, equivalent series inductance, and thermal resistance of capacitors without a metal frame.

Emergent Vision Technologies, announces that its eCapture Pro software now supports GPUDirect, H.265 and H.264 video codecs, and RTMP (real-time messaging protocol) streaming.

IBASE Technology Inc, introduces the low-power IB838 3.5" single board computer, powered by the Intel® Core i3 N-series processor.

This certification qualifies these modules for operation in railway applications, confirming that they meet the requirements for extreme conditions such as extended temperatures, rapid temperature changes, shocks, and vibrations.

MediaTek and TSMC are taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.

International

IBASE Technology Inc, introduces the low-power IB838 3.5" single board computer, powered by the Intel^® Core i3 N-series processor.