15 {{ "2023-08-15T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-15T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

See more, see better! New 10GigE cameras with onsemi XGS sensors up to 45 MP

In industrial automation, the optimization of processes is often primarily about higher efficiency and accuracy. 10GigE cameras, such as those in the uEye Warp10 camera family from IDS Imaging Development Systems GmbH, set standards here. They enable high-speed image processing in Gigabit Ethernet-based networks even with large amounts of data and over long cable distances. For even more precision, the company is now introducing new models with sensors up to 45 MP that reliably capture even the smallest details.

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11 {{ "2023-08-11T00:00:00+00:00" | date "MMM" }} '23

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Mouser News

Mouser unveils Digi XBee 3 Global GNSS LTE CAT 1 Development Kit for IoT Applications

Digi XBee^® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.

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11 {{ "2023-08-11T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-11T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon introduces new automotive 60 V and 120 V OptiMOS 5 in TOLx packages for 24 V-72 V supplied high power ECUs

The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified.

Read more…

10 {{ "2023-08-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-10T00:00:00+00:00" | date "longDate" }}

Antaira News

Antaira 5GHz Wireless AP/Client Bridge Simplifies Point-to-Point/Multipoint Applications

Antaira Technologies is providing a secure, cost-effective way to extend wireless networks with the launch of its AMY-5133-AC-PD Wireless Access Point/Client Bridge.

Read more…

10 {{ "2023-08-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-10T00:00:00+00:00" | date "longDate" }}

Thinesolutions News

THine Introduces THEIA-CAM 13MP PDAF Camera Kit for MediaTek Genio 350 and Genio 500

The Kit Allows MediaTek’s Customers to Integrate THine’s Leading-Edge Imaging Capabilities into AI + IoT Products with Minimal Effort.

Read more…

10 {{ "2023-08-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-10T00:00:00+00:00" | date "longDate" }}

FEIG news

FEIG INTRODUCES NEW RFID HYBRID READER MODULE

With the new RFID hybrid module ID CPR70, FEIG ELECTRONIC presents a high-end HF reader that combines the advantages of the two successful predecessors ISC.M02 and CPR.M02.

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09 {{ "2023-08-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-09T00:00:00+00:00" | date "longDate" }}

Inova Semiconductors News

Inova Semiconductors is going to use Samsung Foundry Services for ISELED products

Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.

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09 {{ "2023-08-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-09T00:00:00+00:00" | date "longDate" }}

TDK News

TDK OFFERS NEW ULTRA-COMPACT SNAP-IN CAPACITOR SERIES WITH EXTREMELY HIGH CAPACITANCE DENSITY

Due to their high reliability, these RoHS-compatible capacitors are optimal for use in high-end switched-mode power supplies and power supplies for industrial and telecommunications applications.

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09 {{ "2023-08-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-09T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK HYNIX SHOWCASES SAMPLES OF WORLD’S FIRST 321-LAYER NAND

The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .

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08 {{ "2023-08-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-08T00:00:00+00:00" | date "longDate" }}

Integrated Graphene News

Humans to provide energy source for smart devices of the future

Researchers from the Institute of Thin Films, Sensors and Imaging (ITFSI) from the University of the West of Scotland (UWS) explored the use of the 3D graphene foam material Gii by Integrated Graphene as an active layer in an energy generator.

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Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

See more, see better! New 10GigE cameras with onsemi XGS sensors up to 45 MP

Mouser unveils Digi XBee 3 Global GNSS LTE CAT 1 Development Kit for IoT Applications

Digi XBee^® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.

Infineon introduces new automotive 60 V and 120 V OptiMOS 5 in TOLx packages for 24 V-72 V supplied high power ECUs

The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified.

Antaira 5GHz Wireless AP/Client Bridge Simplifies Point-to-Point/Multipoint Applications

Antaira Technologies is providing a secure, cost-effective way to extend wireless networks with the launch of its AMY-5133-AC-PD Wireless Access Point/Client Bridge.

THine Introduces THEIA-CAM 13MP PDAF Camera Kit for MediaTek Genio 350 and Genio 500

The Kit Allows MediaTek’s Customers to Integrate THine’s Leading-Edge Imaging Capabilities into AI + IoT Products with Minimal Effort.

FEIG INTRODUCES NEW RFID HYBRID READER MODULE

With the new RFID hybrid module ID CPR70, FEIG ELECTRONIC presents a high-end HF reader that combines the advantages of the two successful predecessors ISC.M02 and CPR.M02.

Inova Semiconductors is going to use Samsung Foundry Services for ISELED products

Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.

TDK OFFERS NEW ULTRA-COMPACT SNAP-IN CAPACITOR SERIES WITH EXTREMELY HIGH CAPACITANCE DENSITY

Due to their high reliability, these RoHS-compatible capacitors are optimal for use in high-end switched-mode power supplies and power supplies for industrial and telecommunications applications.

SK HYNIX SHOWCASES SAMPLES OF WORLD’S FIRST 321-LAYER NAND

The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .

Humans to provide energy source for smart devices of the future

Researchers from the Institute of Thin Films, Sensors and Imaging (ITFSI) from the University of the West of Scotland (UWS) explored the use of the 3D graphene foam material Gii by Integrated Graphene as an active layer in an energy generator.

International

Market Overview

Technical Articles

Case studies

Digi XBee® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.

The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified.

Antaira Technologies is providing a secure, cost-effective way to extend wireless networks with the launch of its AMY-5133-AC-PD Wireless Access Point/Client Bridge.

The Kit Allows MediaTek’s Customers to Integrate THine’s Leading-Edge Imaging Capabilities into AI + IoT Products with Minimal Effort.

With the new RFID hybrid module ID CPR70, FEIG ELECTRONIC presents a high-end HF reader that combines the advantages of the two successful predecessors ISC.M02 and CPR.M02.

Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.

Due to their high reliability, these RoHS-compatible capacitors are optimal for use in high-end switched-mode power supplies and power supplies for industrial and telecommunications applications.

The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .

Researchers from the Institute of Thin Films, Sensors and Imaging (ITFSI) from the University of the West of Scotland (UWS) explored the use of the 3D graphene foam material Gii by Integrated Graphene as an active layer in an energy generator.

International

Digi XBee^® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.