26 {{ "2023-06-26T00:00:00+00:00" | date "MMM" }} '23

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TWK

TWK Offers Safe compact encoders for autonomous vehicles

Safe angle and speed measurement is a key requirement in vehicles, including autonomous industrial trucks. This is possible with functionally safe and certified encoders with a suitable safety interface on rotary axes or drive motors.

Read more…

24 {{ "2023-06-24T00:00:00+00:00" | date "MMM" }} '23

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Toshiba News

Toshiba releases a new range of low current, high input voltage LDO regulators

Toshiba Electronics Europe GmbH (“Toshiba”) has launched the first three devices in the new TCR1HF series of low drop-out (LDO) regulators.

Read more…

22 {{ "2023-06-22T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-06-22T00:00:00+00:00" | date "longDate" }}

Nexperia News

Nexperia broadens package options for its NextPower 80/100 V MOSFET portfolio

Nexperia expands NextPower 80/100 V MOSFETs portfolio to include LFPAK56 and LFPAK88 packaging, expanding its range of semiconductor solutions.

Read more…

22 {{ "2023-06-22T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-06-22T00:00:00+00:00" | date "longDate" }}

Omron Components News

Omron introduces low contact resistance relays for EV chargers and PV homes

Omron Europe introduces low contact resistance model for G7L-2A-X series relays, improving high-power switching capabilities.

Read more…

22 {{ "2023-06-22T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-06-22T00:00:00+00:00" | date "longDate" }}

TE Connectivity News

TE Connectivity partners with tacterion for smart connector and component solutions

TE and tacterion collaborate to create connector and component solutions combining reliable TE connectors with tacterion's sensor technology.

Read more…

22 {{ "2023-06-22T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-06-22T00:00:00+00:00" | date "longDate" }}

Micron News

MICRON OFFERS UFS 4.0 MOBILE STORAGE BUILT ON 232-LAYER 3D NAND

Micron’s newest mobile flash storage outpaces competition on several critical NAND benchmarks, delivering the industry’s fastest performance for flagship smartphones with fast bootup, app launches and video downloads.

Read more…

21 {{ "2023-06-21T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-06-21T00:00:00+00:00" | date "longDate" }}

IAR Systems News

IAR fully supports the latest TRAVEO T2G CYT6BJ Body MCU series from Infineon

With IAR Embedded Workbench for Arm, developers can take advantage of maximized performance, ensured code quality and functional safety when working with the recently introduced Infineon TRAVEO T2G Body MCU family.

Read more…

21 {{ "2023-06-21T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-06-21T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon’s XENSIV PAS CO2 meets the performance criteria of internationally recognized WELL and LEED green building standards

As part of the global effort for decarbonization, improving the energy efficiency of buildings is a critical part of the solution.

Read more…

21 {{ "2023-06-21T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-06-21T00:00:00+00:00" | date "longDate" }}

AMD News

AMD EXPANDS LEADERSHIP DATA CENTER PORTFOLIO WITH NEW EPYC CPUS

AMD is unleashing the power of specialized computing for the data center with new AMD EPYC processors for cloud native and technical computing.

Read more…

20 {{ "2023-06-20T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-06-20T00:00:00+00:00" | date "longDate" }}

CEA Leti News

CEA-Leti and Intel develop thin 2D TMDs using Layer Transfer Technology

CEA-Leti and Intel collaborate on developing layer transfer technology for 2D TMDs on 300mm wafers, aiming to extend Moore's Law beyond 2030.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

TWK Offers Safe compact encoders for autonomous vehicles

Safe angle and speed measurement is a key requirement in vehicles, including autonomous industrial trucks. This is possible with functionally safe and certified encoders with a suitable safety interface on rotary axes or drive motors.

Toshiba releases a new range of low current, high input voltage LDO regulators

Toshiba Electronics Europe GmbH (“Toshiba”) has launched the first three devices in the new TCR1HF series of low drop-out (LDO) regulators.

Nexperia broadens package options for its NextPower 80/100 V MOSFET portfolio

Nexperia expands NextPower 80/100 V MOSFETs portfolio to include LFPAK56 and LFPAK88 packaging, expanding its range of semiconductor solutions.

Omron introduces low contact resistance relays for EV chargers and PV homes

Omron Europe introduces low contact resistance model for G7L-2A-X series relays, improving high-power switching capabilities.

TE Connectivity partners with tacterion for smart connector and component solutions

TE and tacterion collaborate to create connector and component solutions combining reliable TE connectors with tacterion's sensor technology.

MICRON OFFERS UFS 4.0 MOBILE STORAGE BUILT ON 232-LAYER 3D NAND

Micron’s newest mobile flash storage outpaces competition on several critical NAND benchmarks, delivering the industry’s fastest performance for flagship smartphones with fast bootup, app launches and video downloads.

IAR fully supports the latest TRAVEO T2G CYT6BJ Body MCU series from Infineon

With IAR Embedded Workbench for Arm, developers can take advantage of maximized performance, ensured code quality and functional safety when working with the recently introduced Infineon TRAVEO T2G Body MCU family.

Infineon’s XENSIV PAS CO2 meets the performance criteria of internationally recognized WELL and LEED green building standards

As part of the global effort for decarbonization, improving the energy efficiency of buildings is a critical part of the solution.

AMD EXPANDS LEADERSHIP DATA CENTER PORTFOLIO WITH NEW EPYC CPUS

AMD is unleashing the power of specialized computing for the data center with new AMD EPYC processors for cloud native and technical computing.

CEA-Leti and Intel develop thin 2D TMDs using Layer Transfer Technology

CEA-Leti and Intel collaborate on developing layer transfer technology for 2D TMDs on 300mm wafers, aiming to extend Moore's Law beyond 2030.

International