09
'22
Written on
Melexis News
09
'22
Written on
Mediatek News
MediaTek’s New Dimensity 8200 Upgrades Gaming Experiences on Premium 5G Smartphones
Dimensity 8200 offers cutting-edge gaming, display, connectivity, and picture quality features in ultra power-efficient 4nm chipset.
09
'22
Written on
SK Hynix News
SK hynix Develops MCR DIMM – World’s Fastest Server Memory Module
SK hynix Inc. announced today that it has developed working samples of DDR51 Multiplexer Combined Ranks2 (MCR) Dual In-line Memory Module, the world’s fastest server DRAM product. The new product has been confirmed to operate at the data rate of minimum 8Gbps, and at least 80% faster than 4.8Gbps of the existing DDR5 products.
09
'22
Written on
Panasonic Industry News
A proven range of motion detection: Panasonic Industry’s inertial sensor in vehicle engineering
Panasonic Industry’s 6DoF inertial sensor series delivers precise information about the state and motion of a vehicle or machinery - and is already relied on in a wide field of motion applications.
08
'22
Written on
Qualcomm News
New Qualcomm Compact Macro 5G RAN platform optimizes mmWave investments
Introducing a powerful combination of small cell and macro cell innovation.
08
'22
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KLA News
KLA Launches Revolutionary X-Ray Metrology System
New Axion® T2000 Extends Advanced Metrology Portfolio That Addresses Vertical Scaling Challenges in Memory Chip Manufacturing.
08
'22
Written on
Rohde & Schwarz
Rohde & Schwarz and Nothing Technology partnered to get new 5G capable Nothing Phone (1) market-ready
Rohde & Schwarz and Nothing Technology announce their joining of forces in the R&D process to validate the 5G multiband aggregation and the application layer performance for Nothing Technology’s new Phone (1) with the R&S CMX500 one-box signaling tester.
08
'22
Written on
ST News
STMicroelectronics simplifies sustainable product design with USB Type-C® Power Delivery software for STM32 microcontrollers
STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.
08
'22
Written on
ST News
STMicroelectronics boosts EV performance and driving range with new silicon-carbide power modules
Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.
08
'22
Written on
Provertha News
