07
'22
Written on
CapXX News
07
'22
Written on
Rohde & Schwarz
Rohde & Schwarz and MediaTek verify 5G LBS Release 16 features on the R&S TS-LBS test solution
Rohde & Schwarz and MediaTek have successfully verified new location based services (LBS) features for 5G NR as defined in 3GPP Release 16. These features will not only improve emergency caller location, but also support upcoming LBS-related use cases in challenging indoor and outdoor environments with both, satellite based and terrestrial technologies. Rohde & Schwarz has extended the R&S TS-LBS test solution to support these and other Release 16 network based positioning features.
07
'22
Written on
Infineon News
Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated quantum processing units (QPUs).
06
'22
Written on
Nexcom News
NEXCOM Accelerates Data Throughput with NVIDIA SmartNIC Silicon Enabled
In response to rising demand for increased bandwidth of network traffic, NEXCOM, a leading supplier of network appliances, has released a compact single-port 200GbE network interface card (NIC). NL 110FM-OS leverages the award-winning NVIDIA® ConnectX®-6 Dx SmartNIC silicon and a PCIe Gen4 interface that doubles the speed of data transfer, compared with the previous generation PCIe standard.
05
'22
Written on
NEC Corporation News
NEC Expands Global Solutions Delivery Capacity with Acquisition of Aspire Technology, a Network Solutions and System Integration Company
Aspire Technology enhances NEC Open Networks’ suite with expertise in the design and integration of legacy and open networks including disaggregated components in Open RAN 5G networks.
05
'22
Written on
Xfab News
Spectricity Deploys Proprietary Technology at X-FAB to Bring Spectral Imaging to Mobile Devices
X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, and Spectricity, a fabless semiconductor company specializing in the development of multispectral imaging technology have collaborated on a unique imaging solution.
04
'22
Written on
Qualcomm News
New RF Front End connectivity solution to boost Wi-Fi and Bluetooth performance
The last two years have brought significant changes to how we manage our personal and working lives. Many of the activities we used to do elsewhere were unexpectedly pulled into our homes. Suddenly we found ourselves working, learning, and socializing remotely; making video calls; streaming HD movies; playing online games; and more.
04
'22
Written on
Keysight technologies News
Keysight’s Participation in O-RAN Global PlugFest Spring 2022 Enables Ecosystem to Speed Open RAN Technology Development and Specifications Maturity
Comprehensive portfolio used to verify conformance, interoperability, performance, security and demonstrated innovative proof of concepts such as energy savings and AI/ML assisted optimization.
04
'22
Written on
TDK News
Predicting Anomalies Before Breakdowns Occur: Ultracompact Sensor Module Redefines the Status Quo of Equipment Maintenance
Factories and manufacturing sites need to prevent anomalies in machinery and equipment to minimize downtime. Productivity can be raised by predicting problems and performing maintenance preemptively, instead of reacting only after breakdowns have occurred. To facilitate this type of predictive maintenance, TDK has developed i3 Micro Module—the world’s first ultracompact sensor module featuring embedded edge AI.
03
'22
Written on
Intel News
