Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added five products to its lineup of MOSFET gate driver ICs in the TCK42xG Series for mobile devices such as wearables. The new products in the series are equipped with an overvoltage lockout function and control the gate voltage of an external MOSFET according to the input voltage.
Nuremberg will be home to the international embedded industry once again during embedded world Exhibition & Conference. Rohde & Schwarz will be showing its latest test solutions from June 21 to 23, 2022 at booth 4-218 of Nuremberg Exhibition Centre. There, visitors can experience product highlights like the new generation of the R&S RTP high-performance oscilloscope, and they can learn from the Rohde & Schwarz experts about state-of-the art test solutions for all kinds of embedded systems.
Intel’s latest security innovations – cutting-edge product capabilities, demos and real-world use cases – were in the spotlight throughout RSA Conference. At RSA Conference this week in San Francisco, Intel reinforced its commitment to security. At the event, leaders from Intel and its ecosystem partners came together to discuss how the company is addressing some of the toughest security challenges, including hybrid workforces and an increase in connected devices.
Qualcomm Technologies, Inc. today announced the company’s relationship with PATEO CONNECT+ (hereinafter referred to as “PATEO”) in the automotive intelligent cockpit field.
The STMicroelectronics TSB622 general-purpose low-power dual operational amplifier (op amp) enhances ruggedness and flexibility in industrial and automotive applications.
NEC Corporation today announced that it has agreed to collaborate with NTT DOCOMO, INC. (DOCOMO) and NIPPON TELEGRAPH AND TELEPHONE CORPORATION (NTT) on 6th generation mobile communication system (6G) experimental trials.
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced a collaboration with DEKRA, a leading global test house network, to ensure that chipset and device vendors can validate E112 caller location (universal European emergency number) functionality in compliance to a new European Union (EU) regulation.
Conta-Clip introduces the new, inverse and modular KDSI-SR cable entry system for reliable sealing, maximum flexibility and time savings feed-through for cables with and without plugs.
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a new distribution agreement with Innodisk, a premier provider of industrial embedded flash and DRAM storage products and technologies, with a focus on the enterprise, industrial, medical, and aerospace industries.
Expanding on its history of delivering highly integrated processors, Texas Instruments (TI) today introduced new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications.