16
'21
Written on
Rohde & Schwarz
16
'21
Written on
XILINX News
Xilinx Launches Alveo U55C, Its Most Powerful Accelerator Card Ever, Purpose-Built for HPC and Big Data Workloads
Breakthrough HPC clustering solution and simplified programmability enable massive scale-out of cutting-edge compute across existing customer infrastructure and network.
15
'21
Written on
Anritsu News
Full-Vehicle 5G MIMO OTA Test System Adopted by CICV
Anritsu Corporation is pleased to announce that China Intelligent and Connected Vehicles (Beijing) Research Institute Co., Ltd. (CICV) has adopted an over-the-air (OTA) test system in a MIMO environment developed jointly by General Test Systems Inc. (GTS) of Guangdong, China, and Anritsu.
15
'21
Written on
Dunkermotoren News
Brushbound into the IIoT world
Two worlds meet and go hand in hand in the future. On the one hand, we are talking about a brushed DC motor (GR series). This is a universally applicable drive motor that has been very popular for decades precisely because of its simplicity and reliability, and which also runs completely without semiconductors.
15
'21
Written on
4most News
Foremost increase industrial product range by increasing cooperation with IDEC
A wide range of new products for machine builders, industrial control and safety.
15
'21
Written on
Infineon News
Infineon is one of the world’s most sustainable companies. The company has been included in leading index for sustainability for the twelfth time in a row
Infineon Technologies AG is one of the most sustainable publicly listed companies worldwide for the twelfth time in a row. That has been confirmed by its renewed inclusion in the Dow Jones Sustainability World Index and in Dow Jones Sustainability Europe Index, as now published by the investment company RobecoSAM, which specializes in sustainability.
15
'21
Written on
Bunting europe News
Advanced Metal Separation at E-Waste World
The separation and recovery of fine and small metal is vital for the successful recycling of e-waste. On stand 314 at the E-Waste World Conference & Expo (30 November – 1 December 2021, Frankfurt Messe, Germany), Bunting is showcasing advanced metal separation technology specifically used in the recycling of electronics.
15
'21
Written on
IAR Systems News
IAR Systems enables next generation automotive applications with NXP’s S32K3 MCU family
The complete development toolchain IAR Embedded Workbench® for Arm® now supports NXP® Semiconductors’ latest automotive MCU family, S32K3.
12
'21
Written on
PEI-Genesis News
USB connectors for harsh environments
How this household connector is pushing the boundaries of industrial and military applications.
12
'21
Written on
ONSEMI News
