04
'21
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AMS News
04
'21
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ST News
STMicroelectronics Boosts Automotive Innovation with Longevity Extension for Popular Body, Chassis, and Safety Microcontrollers
Availability of SPC56 automotive microcontrollers assured until at least 2034 by extension of longevity program to 20 years.
04
'21
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Hitachi News
Hitachi Developed the Hitachi Electronic Signature Service that Promotes to Eliminate Personal Seals with High Authenticity of Information by Blockchain Technology, and Starts Internal Operations
Go on sale after July as the service that contributes to new workstyle in the New Normal with supporting remote working, operational efficiency and cost reduction.
04
'21
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CEA Leti News
CEA-Leti Announces 17 Papers to Be Presented At Photonics West 2021 and a Virtual Workshop on March 25
CEA-Leti, a technology research institute of CEA Tech, will present 14 papers during Photonics West 2021, March 6-11, including an invited paper, "Advanced roughness characterization for 300mm Si photonics patterning & optimization".
03
'21
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HMS Industrial Networks AB
Ewon Flexy from HMS Networks Achieves ThingWorx Ready Status
HMS Networks launches new PTC Marketplace solution which enables users to bridge machine data to PTC’s ThingWorx® Platform using Ewon® Flexy and the Talk2M® cloud.
03
'21
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Mouser News
MOUSER ELECTRONICS NEW PRODUCT INSIDER: FEBRUARY 2021
Global Distributor Leads in New Product Introductions.
03
'21
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ST News
STMicroelectronics Speeds Smart Devices to Market with Extra Software for Microsoft® Azure RTOS Projects on STM32 MCUs
Fully integrated within STM32Cube ecosystem, software expansion packs build on recently announced joint initiative with Microsoft®.
03
'21
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NXP News
NXP Unveils Advanced i.MX Applications Processors with Easy-to-Deploy Security, Energy Efficiency and Scalability for the Industrial and IoT Edge
NXP Semiconductors N.V. (NASDAQ: NXPI) today announces the expansion of its EdgeVerse portfolio with its crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high performance intelligent applications processors.
03
'21
Written on
ZS-Handling GmbH
Contactless Handling of Wafers in the Solar Industry
Gentle and fast handling with ultrasound
03
'21
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Rohde & Schwarz
