18
'20
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KEMET News
18
'20
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Vision Components News
Raspi CM goes embedded vision with VC MIPI
Launching its new VC MIPI Embedded Vision Kit for the Raspberry Pi Compute Module 3 or 3+, Vision Components enables quick setup of full-fledged, industrial-grade embedded vision systems.
18
'20
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Vector News
Bringing High-Performance into the Vehicle: Take Advantage of Everything That AUTOSAR Has to Offer with PREEvision 9.5
Modern electric/electronic systems combine the computing power needed for data-rich applications with the flexibility to improve and evolve during life time by updates and upgrades. PREEvision 9.5 helps you to develop such future-proof E/E systems based on high-performance computers and the AUTOSAR Adaptive platform. With PREEvision, you can easily integrate HPCs and AUTOSAR Adaptive into existing architectures.
18
'20
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Leuze
Specialized in packaging machines for confectionery and baked goods: The new DRT 25C from Leuze
The primary and secondary packaging of confectionery and baked goods can be challenging: The new DRT 25C dynamic reference diffuse sensor from Leuze solves precisely this problem in an innovative and reliable way: with a one-of-a-kind reference technology and three light spots.
18
'20
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Infineon News
SECORA™ ID S: highest security and flexibility for region-specific electronic ID cards and eGovernment solutions
With SECORA™ ID, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers an easy-to-integrate security platform for contactless digital ID documents.
17
'20
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Mitsubishi Electric News
Mitsubishi Electric to Launch N-series 1200V SiC-MOSFET
Low power consumption and miniaturization of power-supply systems, such as EV on-board chargers.
17
'20
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CEA Leti News
CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
Virtual Presentation During VLSI 2020 Details Transistors' Performance And Power-Use Advantages Versus FinFET Devices.
17
'20
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TDK News
TDK announces world’s lowest-power PDM microphone, T3902
T3902 is a 64.5dB SNR/120dB AOP digital microphone in a 3.5 x 2.65 x 0.98 mm package, optimized for mobile devices, wearables, headsets, TV remotes and more.
17
'20
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Infineon News
Danfoss secures capacities for electro-mobility chips at Infineon
In view of the long-term growing market demand for power semiconductors for electric cars, Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit. The chips are mainly used in power modules for inverters that control the motors in electric vehicles.
16
'20
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Infineon News
