02 {{ "2023-10-02T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-10-02T00:00:00+00:00" | date "longDate" }}

Trumpf News

TRUMPF to announce technology breakthrough in reducing RMS and RIN values at ECOC 2023

TRUMPF showcases advancements in datacom VCSELs and photodiodes, demonstrating great progress in long-wavelength VCSELs and 100G developments, and demonstrating 100G datacom VCSELs for high-speed optical data communication.

Read more…

02 {{ "2023-10-02T00:00:00+00:00" | date "MMM" }} '23

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Microchip News

MICROCHIP PRESENTS 28-NM SUPERFLASH^® EMBEDDED FLASH MEMORY SOLUTION

The widely deployed Non-Volatile Memory (NVM) solution is optimized for microcontrollers (MCUs), smart cards and IoT chips.

Read more…

02 {{ "2023-10-02T00:00:00+00:00" | date "MMM" }} '23

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Intel News

INTEL’S NEW FAB IN IRELAND BEGINS HIGH-VOLUME PRODUCTION OF INTEL 4 TECHNOLOGY

Intel deploys extreme ultraviolet lithography in high-volume manufacturing; use of the technology in Ireland is a first for mass production in Europe.

Read more…

29 {{ "2023-09-29T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-29T00:00:00+00:00" | date "longDate" }}

e-con Systems News

e-con Systems™ launches superior HDR multi-camera solution for NVIDIA Jetson Orin to revolutionize autonomous mobility

e-con Systems™, has recently launched STURDeCAM31 - a 3MP GMSL2 HDR IP69K camera powered by Sony^® ISX031 sensor for NVIDIA^® Jetson AGX Orin™.

Read more…

29 {{ "2023-09-29T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-29T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Sivers Photonics demonstrates next-generation DFB laser arrays supporting 4 Terabit GPU to GPU communication for Generative AI applications

Sivers Semiconductors, will be present at the upcoming European Conference on Optical Communication 2023, taking place in the company’s hometown of Glasgow at the Scottish Exhibition Centre from 1 – 5 October 2023.

Read more…

29 {{ "2023-09-29T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-29T00:00:00+00:00" | date "longDate" }}

Congatec News

Congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors

High-end edge AI and vision processing in ultra-low power envelop.

Read more…

29 {{ "2023-09-29T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-29T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon launches an Electronically-Marked Cable Assembly controller with EPR supporting protection up to 54 V for passive USB-C cables

The rapid industrial adoption of USB-C is owed to its slim design, user-friendly and universal connectors, and versatility in handling multiple data protocols, such as USB4, Thunderbolt, and HDMI.

Read more…

28 {{ "2023-09-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-28T00:00:00+00:00" | date "longDate" }}

Littelfuse News

Littelfuse Launches Its Most Compact Arc-Flash Relay for Tight Spaces

Littelfuse, launches its AF0025 series, a cost-effective arc-flash protection solution in our most compact package for OEM applications.

Read more…

28 {{ "2023-09-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-28T00:00:00+00:00" | date "longDate" }}

MIkroe News

New motion sensor board from MIKROE uses Doppler Shift technology

MikroElektronika, has introduced a new motion sensor Click™ board, to support the development of intrusion alarms, automatic door openers, presence-sensing applications, and more.

Read more…

28 {{ "2023-09-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-28T00:00:00+00:00" | date "longDate" }}

Bourns News

Bourns Expands its Silicon Carbide Schottky Barrier Diode Product Family with 10 New Models

Additional 650 and 1200V SiC Diode BSD models address the power density requirements of today's transportation, renewable energy and industrial systems.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

TRUMPF to announce technology breakthrough in reducing RMS and RIN values at ECOC 2023

TRUMPF showcases advancements in datacom VCSELs and photodiodes, demonstrating great progress in long-wavelength VCSELs and 100G developments, and demonstrating 100G datacom VCSELs for high-speed optical data communication.

MICROCHIP PRESENTS 28-NM SUPERFLASH^® EMBEDDED FLASH MEMORY SOLUTION

The widely deployed Non-Volatile Memory (NVM) solution is optimized for microcontrollers (MCUs), smart cards and IoT chips.

INTEL’S NEW FAB IN IRELAND BEGINS HIGH-VOLUME PRODUCTION OF INTEL 4 TECHNOLOGY

Intel deploys extreme ultraviolet lithography in high-volume manufacturing; use of the technology in Ireland is a first for mass production in Europe.

e-con Systems™ launches superior HDR multi-camera solution for NVIDIA Jetson Orin to revolutionize autonomous mobility

e-con Systems™, has recently launched STURDeCAM31 - a 3MP GMSL2 HDR IP69K camera powered by Sony^® ISX031 sensor for NVIDIA^® Jetson AGX Orin™.

Sivers Photonics demonstrates next-generation DFB laser arrays supporting 4 Terabit GPU to GPU communication for Generative AI applications

Sivers Semiconductors, will be present at the upcoming European Conference on Optical Communication 2023, taking place in the company’s hometown of Glasgow at the Scottish Exhibition Centre from 1 – 5 October 2023.

Congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors

High-end edge AI and vision processing in ultra-low power envelop.

Infineon launches an Electronically-Marked Cable Assembly controller with EPR supporting protection up to 54 V for passive USB-C cables

The rapid industrial adoption of USB-C is owed to its slim design, user-friendly and universal connectors, and versatility in handling multiple data protocols, such as USB4, Thunderbolt, and HDMI.

Littelfuse Launches Its Most Compact Arc-Flash Relay for Tight Spaces

Littelfuse, launches its AF0025 series, a cost-effective arc-flash protection solution in our most compact package for OEM applications.

New motion sensor board from MIKROE uses Doppler Shift technology

MikroElektronika, has introduced a new motion sensor Click™ board, to support the development of intrusion alarms, automatic door openers, presence-sensing applications, and more.

Bourns Expands its Silicon Carbide Schottky Barrier Diode Product Family with 10 New Models

Additional 650 and 1200V SiC Diode BSD models address the power density requirements of today's transportation, renewable energy and industrial systems.

International

Market Overview

Technical Articles

Case studies

TRUMPF showcases advancements in datacom VCSELs and photodiodes, demonstrating great progress in long-wavelength VCSELs and 100G developments, and demonstrating 100G datacom VCSELs for high-speed optical data communication.

The widely deployed Non-Volatile Memory (NVM) solution is optimized for microcontrollers (MCUs), smart cards and IoT chips.

Intel deploys extreme ultraviolet lithography in high-volume manufacturing; use of the technology in Ireland is a first for mass production in Europe.

e-con Systems™, has recently launched STURDeCAM31 - a 3MP GMSL2 HDR IP69K camera powered by Sony® ISX031 sensor for NVIDIA® Jetson AGX Orin™.

Sivers Semiconductors, will be present at the upcoming European Conference on Optical Communication 2023, taking place in the company’s hometown of Glasgow at the Scottish Exhibition Centre from 1 – 5 October 2023.

High-end edge AI and vision processing in ultra-low power envelop.

The rapid industrial adoption of USB-C is owed to its slim design, user-friendly and universal connectors, and versatility in handling multiple data protocols, such as USB4, Thunderbolt, and HDMI.

Littelfuse, launches its AF0025 series, a cost-effective arc-flash protection solution in our most compact package for OEM applications.

MikroElektronika, has introduced a new motion sensor Click™ board, to support the development of intrusion alarms, automatic door openers, presence-sensing applications, and more.

Additional 650 and 1200V SiC Diode BSD models address the power density requirements of today's transportation, renewable energy and industrial systems.

International

e-con Systems™, has recently launched STURDeCAM31 - a 3MP GMSL2 HDR IP69K camera powered by Sony^® ISX031 sensor for NVIDIA^® Jetson AGX Orin™.