The new PhotoMOS® HE relay series from Panasonic Industry Europe offers 5kV I/O isolation and an increased clearance and creepage distance on output side, plus miniature 1-Form-A DIP5 packaging, making it particularly suitable as the switching solution for Battery Management Systems (BMS) in storage systems, charging stations, and numerous other high voltage measurement and infrastructure.
Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.
As the mobile industry is coming together at Mobile World Congress 2022 in Las Vegas, it becomes clear that 5G is already all around us. The technology is being rolled out with unprecedented speed of adoption in devices, mobile network infrastructure and network deployment.
Sivers Semiconductors AB announces today that its subsidiary Sivers Wireless will exhibit at the European Microwave Exhibition, 27-29 September, during the European Microwave Week in Milan, Italy, together with its partner Richardson RFPD in booth #C28.
CEVA, Inc., the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, today introduced PentaG-RAN, the industry's first 5G baseband platform IP for ASICs targeting cellular infrastructure in both base station and radio configurations, including distributed units (DU), and Remote Radio Units (RRU), from small cell to Massive Multiple-Input, Multiple Output (mMIMO).
Rohde & Schwarz presents an innovative signal generation and analysis solution for measurements in the D band that will significantly simplify early next generation mobile communications research. The new R&S FE170 frontend extensions are easy to mount to and configure with the R&S SMW200A vector signal generator and the R&S FSW signal and spectrum analyzer. The extensions will allow the two high-end test instruments to cover frequency ranges between 110 GHz and 170 GHz – key spectrum for beyond 5G, for 6G technology and for future automotive radar applications.
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced a collaboration with Jiyun Technologies to develop and deliver a tailored, compact battery test system for electric vehicles (EVs).
In order to contribute to reducing the carbon footprint of digital technologies through research and development, the Fraunhofer and Leibniz institutes cooperating in the Forschungsfabrik Mikroelektronik Deutschland (Research Factory Microelectronics Germany) are jointly establishing a cross-site competence center for resource-conscious information and communications technology (Green ICT @ FMD).
Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today launched PowerPros℠, a live online video tech support service that enables power-supply designers to talk directly with members of Power Integrations’ applications engineering team 24 hours a day, six days a week, anywhere in the world.
A consortium of Fraunhofer institutes and well-known German industrial companies is developing a split-manufacturing approach for semiconductor production in the project "Distributed Manufacturing for Novel and Trustworthy Electronics T4T". This will enable the secure assembly of subsystems in Germany and safeguard supply chains.