TDK Corporation (TSE 6762) announces the introduction of 20U high, 19-inch rack cabinet high power solutions to the TDK-Lambda GENESYS+ series of programmable DC power supplies.
MediaTek inc. and Anritsu Corporation are pleased to announce that the first DAPS handover for 5G New Radio (NR) has been verified with a device containing the MediaTek M80 5G modem and Anritsu’s MT8000A Radio Communication Test Station with Rapid Test Designer (RTD) application software.
NTT DOCOMO, INC. (DOCOMO) and NEC Corporation (NEC) have launched a proof-of-concept (PoC) testing to run NEC's 5G core network (5GC) service in a hybrid cloud environment that leverages the Amazon Web Services (AWS) cloud using end-to-end cloud-native network architecture.
AFMETCAL, the Air Force Metrology and Calibration Authority, has been seeking to purchase microwave measurement receivers (MMR) for its precision measurement equipment laboratories (PMEL’s) and Air Force primary standards laboratory (AFPSL). According to these requirements Rohde & Schwarz has developed the R&S FSMR3000AF measuring receiver to calibrate signal generators and attenuators with one single instrument. Most important features provided are tuned RF level measurements, level measurements, analog modulation and spectrum analysis. This is the second order in between months, which AFMETCAL has placed with Rohde & Schwarz.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top manufacturer of micro-electro-mechanical systems (MEMS), is introducing its third generation of MEMS sensors.
KREEMO and Sivers Semiconductors announced that they had succeeded in developing the world’s first high performance 5G module with a 360o coverage for metaverse at MWC 2022.
The funding round, which includes current investors Parkwalk and Amadeus, will enable the business to increase its technological capacity globally and enhance its R&D capabilities.
Scalable Ultra-High Resolution and Instant Autofocus Camera is now Available for a Variety of Operating Systems, Single Board Computers, and System on Chip Design Platforms.
Committed to setting new technology standards in discrete power MOSFET technologies, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced its new PQFN 2 x 2 mm 2 OptiMOS 5 25 V and 30 V product family.
Nexans’ JTS heat-shrinkable joint represents a technical innovation which simplifies the installation process. The new technology improves overall reliability of power distribution networks, shortens the installation time, and reduces joint failure risks.