Anritsu's multi-channel OTDR solution for weakly coupled multi-core fiber visualizes crosstalk and loss to optimize next-gen optical communications infrastructure.
TDK expands CUS-M series with 1200W models, offering 95.5% efficiency, compact 187×93×42.5 mm size, medical-grade safety certifications, and ultra-low noise.
Microchip's new GNSS Disciplined Oscillator Modules make it simple to integrate Position, Navigation and Timing (PNT) technology into a wide range of applications.
Enhanced thermal performance, reduced inductance, and 2.3x higher power density with flexible half-bridge and common-source topologies for next-generation PV inverters, UPS, and multi-level power circuits.
SVS-Vistek's SenSWIR FXO cameras use a 400-1700 nm range to identify subsurface wafer flaws, offering 5.2MP resolution and TEC cooling for high-speed inspection.