02 {{ "2025-10-02T00:00:00+00:00" | date "MMM" }} '25

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AMD News

IBM & AMD Partner with Zyphra to Advance AI Infrastructure

IBM and AMD supply Zyphra with MI300X GPU clusters on IBM Cloud, enabling large-scale multimodal AI model training and innovation.

Read more…

01 {{ "2025-10-01T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-01T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Würth Elektronik presents its Tarvos e and Olis e radio modules

Würth Elektronik presents compact Tarvos e and Olis e radio modules, 12×8×2 mm, CC1310-based, energy-efficient, ideal for proprietary wireless solutions and battery-powered devices.

Read more…

01 {{ "2025-10-01T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-01T00:00:00+00:00" | date "longDate" }}

ASMPT News

ASMPT and Viscom Enable Adaptive SMT Production for Schaeffler

Schaeffler implements ASMPT SIPLACE SX and Viscom AOI systems, creating connected SMT lines that automatically adapt to alternative components for efficient, flexible electronics production.

Read more…

01 {{ "2025-10-01T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-01T00:00:00+00:00" | date "longDate" }}

MICRO EPSILON News

micro epsilon present Next-generation high-performance confocal chromatic controllers

The new confocalDT IFC2411 and IFC2416 controllers offer precise, fast distance and thickness measurements up to 25 kHz, high light intensity, and easy industrial integration via modern interfaces.

Read more…

01 {{ "2025-10-01T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-01T00:00:00+00:00" | date "longDate" }}

CEA Leti News

CEA-Leti Unveils Hybrid Memory for On-Chip AI Training

CEA-Leti and French research partners created a CMOS-compatible hybrid memory combining ferroelectric capacitors and memristors, enabling adaptive on-chip AI learning and inference for edge devices.

Read more…

01 {{ "2025-10-01T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-01T00:00:00+00:00" | date "longDate" }}

Texas Instruments News

Texas Instruments Unveils DLP991UUV for High-Resolution Digital Lithography

The DLP991UUV features 8.9M pixels, sub-micron resolution, and 110 gigapixels/sec throughput, enabling scalable, cost-effective maskless lithography for advanced packaging.

Read more…

29 {{ "2025-09-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-29T00:00:00+00:00" | date "longDate" }}

PickeringTest News

Pickering Unveils New 5A Battery Simulator

The next-gen 5A PXI/PXIe battery simulator enables precise BMS testing with four fully isolated channels per slot, high-current drive, and integrated hardware safety features.

Read more…

29 {{ "2025-09-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-29T00:00:00+00:00" | date "longDate" }}

TDK News

TDK at SEMICON West 2025

TDK will showcase its latest semiconductor technologies at SEMICON West 2025, across three booths, October 7–9 in Phoenix, AZ.

Read more…

29 {{ "2025-09-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-29T00:00:00+00:00" | date "longDate" }}

ARBOR Technology News

ARBOR SP-241C-1N305: Rugged Fanless Industrial Panel PC

Powered by Intel Core i3-N305, this 23.8” fanless system features IP66 protection, dual 2.5GbE LAN, wide voltage input, and versatile mounting for harsh industrial environments.

Read more…

26 {{ "2025-09-26T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-26T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip launches MCP9604 four-channel thermocouple IC with ±1.5°C accuracy

Microchip’s MCP9604 IC enables precise four-channel thermocouple measurement, ±1.5°C accuracy, supports -200°C to +1372°C range, reducing 15 discrete components.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

IBM & AMD Partner with Zyphra to Advance AI Infrastructure

IBM and AMD supply Zyphra with MI300X GPU clusters on IBM Cloud, enabling large-scale multimodal AI model training and innovation.

Würth Elektronik presents its Tarvos e and Olis e radio modules

Würth Elektronik presents compact Tarvos e and Olis e radio modules, 12×8×2 mm, CC1310-based, energy-efficient, ideal for proprietary wireless solutions and battery-powered devices.

ASMPT and Viscom Enable Adaptive SMT Production for Schaeffler

Schaeffler implements ASMPT SIPLACE SX and Viscom AOI systems, creating connected SMT lines that automatically adapt to alternative components for efficient, flexible electronics production.

micro epsilon present Next-generation high-performance confocal chromatic controllers

The new confocalDT IFC2411 and IFC2416 controllers offer precise, fast distance and thickness measurements up to 25 kHz, high light intensity, and easy industrial integration via modern interfaces.

CEA-Leti Unveils Hybrid Memory for On-Chip AI Training

CEA-Leti and French research partners created a CMOS-compatible hybrid memory combining ferroelectric capacitors and memristors, enabling adaptive on-chip AI learning and inference for edge devices.

Texas Instruments Unveils DLP991UUV for High-Resolution Digital Lithography

The DLP991UUV features 8.9M pixels, sub-micron resolution, and 110 gigapixels/sec throughput, enabling scalable, cost-effective maskless lithography for advanced packaging.

Pickering Unveils New 5A Battery Simulator

The next-gen 5A PXI/PXIe battery simulator enables precise BMS testing with four fully isolated channels per slot, high-current drive, and integrated hardware safety features.

TDK at SEMICON West 2025

TDK will showcase its latest semiconductor technologies at SEMICON West 2025, across three booths, October 7–9 in Phoenix, AZ.

ARBOR SP-241C-1N305: Rugged Fanless Industrial Panel PC

Powered by Intel Core i3-N305, this 23.8” fanless system features IP66 protection, dual 2.5GbE LAN, wide voltage input, and versatile mounting for harsh industrial environments.

Microchip launches MCP9604 four-channel thermocouple IC with ±1.5°C accuracy

Microchip’s MCP9604 IC enables precise four-channel thermocouple measurement, ±1.5°C accuracy, supports -200°C to +1372°C range, reducing 15 discrete components.

International

Market Overview

Technical Articles

Case studies

IBM and AMD supply Zyphra with MI300X GPU clusters on IBM Cloud, enabling large-scale multimodal AI model training and innovation.

Würth Elektronik presents compact Tarvos e and Olis e radio modules, 12×8×2 mm, CC1310-based, energy-efficient, ideal for proprietary wireless solutions and battery-powered devices.

Schaeffler implements ASMPT SIPLACE SX and Viscom AOI systems, creating connected SMT lines that automatically adapt to alternative components for efficient, flexible electronics production.

The new confocalDT IFC2411 and IFC2416 controllers offer precise, fast distance and thickness measurements up to 25 kHz, high light intensity, and easy industrial integration via modern interfaces.

CEA-Leti and French research partners created a CMOS-compatible hybrid memory combining ferroelectric capacitors and memristors, enabling adaptive on-chip AI learning and inference for edge devices.

The DLP991UUV features 8.9M pixels, sub-micron resolution, and 110 gigapixels/sec throughput, enabling scalable, cost-effective maskless lithography for advanced packaging.

The next-gen 5A PXI/PXIe battery simulator enables precise BMS testing with four fully isolated channels per slot, high-current drive, and integrated hardware safety features.

TDK will showcase its latest semiconductor technologies at SEMICON West 2025, across three booths, October 7–9 in Phoenix, AZ.

Powered by Intel Core i3-N305, this 23.8” fanless system features IP66 protection, dual 2.5GbE LAN, wide voltage input, and versatile mounting for harsh industrial environments.

Microchip’s MCP9604 IC enables precise four-channel thermocouple measurement, ±1.5°C accuracy, supports -200°C to +1372°C range, reducing 15 discrete components.

International

Würth Elektronik presents compact Tarvos e and Olis e radio modules, 12×8×2 mm, CC1310-based, energy-efficient, ideal for proprietary wireless solutions and battery-powered devices.