17
'25
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MIkroe News
17
'25
Written on
Fischer Elektronik News
New Pogo Pin single contacts and male headers
Fischer Elektronik expands its connector portfolio with new spring-loaded pins, available as single contacts or pin headers with 1 to 50 poles for flexible PCB connections.
17
'25
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Vector News
Vector Launches cube:tap Interface for Efficient LTE-V2X Testing
The cube:tap provides plug-and-play LTE-V2X measurement, configurable global communication, integrated GNSS for time/position sync, and supports multiple virtual ITS stations for complex ECU validation.
17
'25
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Broadcom News
Broadcom Introduces Industry’s First 800G AI Ethernet NIC
Thor Ultra is Fully Compliant with Ultra Ethernet Consortium; Delivers Cutting-Edge Performance, Scalability, and Reliability for AI Scale-Out Networking.
16
'25
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Microchip News
Microchip Skywire Simplifies Clock Alignment
Microchip's BlueSky and SkyWire technology enable geographically dispersed clocks in critical infrastructure (like air traffic, finance) to achieve nanosecond-level alignment and comparison, ensuring robust timing.
16
'25
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Broadcom News
Broadcom Tomahawk 6 Davisson Achieves 102.4 Tbps
Broadcom launched Tomahawk® 6 – Davisson, the industry's first 102.4 Tbps Ethernet switch with Co-Packaged Optics (CPO), doubling bandwidth and cutting optical interconnect power consumption by 70% for AI networking.
16
'25
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Silicon Labs News
Silicon Labs Series 3 SoCs launch for next-gen connectivity
Silicon Labs announced the general availability of its new 22 nm Series 3 SoCs, featuring multi-core architecture and the world's first PSA Level 4 security to accelerate secure, feature-rich IoT and Matter deployments.
16
'25
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Vishay News
Vishay Launches AEC-Q200 Qualified 50 W Thick Film Resistor for Automotive Systems
Designed for Direct Mounting on a Heatsink, Compact Device Withstands High Temperatures, Humidity, Vibration, and Electrical Stress.
15
'25
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Infineon News
Infineon advances AI data center power architecture
Infineon is collaborating with NVIDIA to drive the 800 VDC power architecture for AI data centers using SiC and GaN solutions, ensuring high efficiency, reliability, and serviceability to minimize downtime and carbon footprint.
15
'25
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Kyocera News
