Nordic Semiconductor highlights its chip-to-cloud wireless ecosystem featuring nRF54L SoCs, cellular IoT, Edge AI, and cloud services at Embedded World North America 2025, from November 4–6, in Anaheim, California.
Infineon’s new XENSIV TLE4971/TLI4971 sensors deliver 0.7% accuracy, reinforced isolation, and fast overcurrent protection for automotive and industrial power systems.
New sensors leverage market-leading technology for both global and rolling shutter modes, with a compact 2.25µm pixel with advanced 3D stacking, and on-chip RGB-IR separation.
The new TO-247PLUS-4 Reflow package enables higher DC-link voltages, improved thermal performance, and robust operation up to 200°C, optimizing power density in demanding industrial and e-mobility applications.
BOPLA introduces the BoVersa enclosure combining modular design, IP66/IP68 protection, and aluminum cooling fins for efficient wireless and embedded electronic systems.
Rutronik expands its portfolio with Amphenol’s Minitek Pwr 3.0 connector, offering 5 A per contact and robust performance for industrial and medical systems.