15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Rutronik News

Rutronik Expands Portfolio With High-Temperature YT Hybrid Capacitors

SAMWHA’s YT series offers low ESR, high ripple resistance, and AEC-Q200 qualification, ensuring reliable performance up to +150 °C for automotive and industrial electronics.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Toshiba News

Toshiba Pioneers 12-Disk HDD Stacking Technology

By combining 12-disk stacking with MAMR innovation, Toshiba aims to target 40TB-class 3.5-inch hard drives by 2027, thereby enhancing density, durability, and efficiency for next-generation data centres.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Yamaha Motor News

Yamaha boosts surface-mount programming efficiency with latest software release

Yamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

AMD News

AMD Unveils “Helios” Open Rack Platform for Scalable AI Infrastructure

Showcased at OCP Global Summit 2025, the Helios platform supports gigawatt-scale AI data centers with open, liquid-cooled, double-wide racks.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Introduces Industry’s First Wi-Fi 8 Silicon Ecosystem Powering the AI Era

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

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Nvidia News

NVIDIA Unveils DGX Spark, the World’s Smallest AI Supercomputer

The compact DGX Spark delivers 1 petaflop performance and 128GB unified memory, enabling developers to run 200B-parameter AI models locally.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

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TE Connectivity News

TE advances next-generation high-density data centers at the 2025 OCP Global Summit

TE Connectivity will showcase a broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-14T00:00:00+00:00" | date "longDate" }}

TDK News

TDK to showcase ultra-low-power sensing and processing solution powered by Renesas

The new reference board combines the Renesas RA2L2 MCU with a 48 MHz Arm Cortex-M23 and USB Type-C 2.4 support, and the InvenSense ICM-42688-P 6-axis MEMS sensor with 2.8 mdps/√Hz gyro and 70 µg/√Hz accelerometer noise.

Read more…

13 {{ "2025-10-13T00:00:00+00:00" | date "MMM" }} '25

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Allied Market Research

FPGA Market Growth Forecast through 2030

According to a study by Allied Market Research, the global FPGA component market is expected to experience significant growth between 2021 and 2030.

Read more…

10 {{ "2025-10-10T00:00:00+00:00" | date "MMM" }} '25

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Kontron News

Kontron and EIZO Partner to Deliver Integrated VPX CPU/GPU Platforms

Kontron integrates EIZO’s NVIDIA-based GPU technology into its VPX systems, delivering rugged, mission-ready CPU/GPU platforms with TSN-enabled interoperability for defense applications.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Rutronik Expands Portfolio With High-Temperature YT Hybrid Capacitors

SAMWHA’s YT series offers low ESR, high ripple resistance, and AEC-Q200 qualification, ensuring reliable performance up to +150 °C for automotive and industrial electronics.

Toshiba Pioneers 12-Disk HDD Stacking Technology

By combining 12-disk stacking with MAMR innovation, Toshiba aims to target 40TB-class 3.5-inch hard drives by 2027, thereby enhancing density, durability, and efficiency for next-generation data centres.

Yamaha boosts surface-mount programming efficiency with latest software release

Yamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.

AMD Unveils “Helios” Open Rack Platform for Scalable AI Infrastructure

Showcased at OCP Global Summit 2025, the Helios platform supports gigawatt-scale AI data centers with open, liquid-cooled, double-wide racks.

Broadcom Introduces Industry’s First Wi-Fi 8 Silicon Ecosystem Powering the AI Era

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

NVIDIA Unveils DGX Spark, the World’s Smallest AI Supercomputer

The compact DGX Spark delivers 1 petaflop performance and 128GB unified memory, enabling developers to run 200B-parameter AI models locally.

TE advances next-generation high-density data centers at the 2025 OCP Global Summit

TE Connectivity will showcase a broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures.

TDK to showcase ultra-low-power sensing and processing solution powered by Renesas

The new reference board combines the Renesas RA2L2 MCU with a 48 MHz Arm Cortex-M23 and USB Type-C 2.4 support, and the InvenSense ICM-42688-P 6-axis MEMS sensor with 2.8 mdps/√Hz gyro and 70 µg/√Hz accelerometer noise.

FPGA Market Growth Forecast through 2030

According to a study by Allied Market Research, the global FPGA component market is expected to experience significant growth between 2021 and 2030.

Kontron and EIZO Partner to Deliver Integrated VPX CPU/GPU Platforms

Kontron integrates EIZO’s NVIDIA-based GPU technology into its VPX systems, delivering rugged, mission-ready CPU/GPU platforms with TSN-enabled interoperability for defense applications.

International

Market Overview

Technical Articles

Case studies

SAMWHA’s YT series offers low ESR, high ripple resistance, and AEC-Q200 qualification, ensuring reliable performance up to +150 °C for automotive and industrial electronics.

By combining 12-disk stacking with MAMR innovation, Toshiba aims to target 40TB-class 3.5-inch hard drives by 2027, thereby enhancing density, durability, and efficiency for next-generation data centres.

Yamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.

Showcased at OCP Global Summit 2025, the Helios platform supports gigawatt-scale AI data centers with open, liquid-cooled, double-wide racks.

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

The compact DGX Spark delivers 1 petaflop performance and 128GB unified memory, enabling developers to run 200B-parameter AI models locally.

TE Connectivity will showcase a broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures.

The new reference board combines the Renesas RA2L2 MCU with a 48 MHz Arm Cortex-M23 and USB Type-C 2.4 support, and the InvenSense ICM-42688-P 6-axis MEMS sensor with 2.8 mdps/√Hz gyro and 70 µg/√Hz accelerometer noise.

According to a study by Allied Market Research, the global FPGA component market is expected to experience significant growth between 2021 and 2030.

Kontron integrates EIZO’s NVIDIA-based GPU technology into its VPX systems, delivering rugged, mission-ready CPU/GPU platforms with TSN-enabled interoperability for defense applications.

International

SAMWHA’s YT series offers low ESR, high ripple resistance, and AEC-Q200 qualification, ensuring reliable performance up to +150 °C for automotive and industrial electronics.