Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

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Bihl + Wiedemann News

Boost Fail-Safety with Redundant Power Supply Using Bihl+Wiedemann Module

The BW5182 redundancy module uses two 30 V power supplies to maintain uninterrupted operation, reducing downtime through seamless automatic failover.

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Keysight technologies News

Keysight Launches EMI Test Receiver with Real-Time 1 GHz Bandwidth

Keysight's upgraded PXE EMI Receiver enables real-time, gapless 1 GHz scans, reducing testing time and streamlining EMC certification workflows.

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Vishay News

Vishay Launches High-Performance RGB LED for Versatile Lighting

Vishay’s PLCC-6 RGB LED enables full-color mixing with 2800 mcd output, separate RGB control, AEC-Q102 qualification, and high ESD and thermal resistance.

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Vecow News

Vecow HEC-1000 Secures TEMPEST Level A for NATO Deployments

This rugged fanless computer enables TEMPEST Level A certification for secure, air-gapped NATO operations requiring electromagnetic emission protection and tactical reliability.

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17 {{ "2025-07-17T00:00:00+00:00" | date "MMM" }} '25

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Ransemi News

RANsemi Launches Plug-and-Play Baseband Board for Split 7.2 Open RAN Radio Units

Powered by RANsemi’s RU baseband SoC and TI’s 5G transceiver, RNS805-RU-BB delivers full-band 5G/4G flexibility and neutral host capability with multi-band, multi-operator functionality.

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Powell Electronics News

Harting’s Domino Modules Optimize Industrial Connector Design

Powell offers Harting’s Domino connectors that combine power, signals, data, and air in compact modules, reducing weight and space by up to 50%.

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Kyocera News

KYOCERA AVX Unveils Compact 3dB 90° Hybrid Couplers

New thin-film couplers offer high RF performance, 1W power handling, and compact size for next-gen wireless systems.

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Infineon News

Infineon Advances 300mm GaN Manufacturing Roadmap

Chip production on 300mm wafers is technically more advanced and efficient than 200mm, yielding 2.3 times more chips per wafer.

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Micron News

Micron Elevates PC Performance with New SSD, AWT

Micron unveils the 2600 NVMe SSD with 9th-gen QLC NAND and Adaptive Write Technology, enhancing PC performance, productivity, and AI PC applications.

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16 {{ "2025-07-16T00:00:00+00:00" | date "MMM" }} '25

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IDS Imaging Development Systems GmbH

IDS integrates Sony IMX900 into uEye low-cost models

The 2.25 µm miniature pixels of the compact global shutter sensor with a resolution of 3.2 MP (2048 x 1536 pixels) deliver brilliant results, even with fast-moving objects.

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