21
'25
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Infineon News
21
'25
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Microchip News
Microchip's AVR SD microcontrollers enhance safety, reduce design costs, and complexity
Microchip’s AVR SD MCU family enables industry-standard functional safety compliance at a price point under a dollar.
21
'25
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SK Hynix News
SK hynix Ships World’s First 12-Layer HBM4 Samples to Customers
Provision of 12-layer HBM4 samples, a new DRAM product with ultra-high performance for AI, to major customers comes earlier than scheduled.
21
'25
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Conrad News
Conrad Unveils Fluke LinkIQ Duo: A Powerful Cable, WiFi, and Network Tester
Fluke Networks enhances its LinkIQ Duo with advanced WiFi 6E troubleshooting, offering an all-in-one solution for cable, WiFi, and network testing to meet the demands of high-bandwidth networks.
20
'25
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TDK News
TDK launches automotive power-over-coax inductors for up to 1600 mA
TDK expands its ADL3225VF series of wire-wound inductors for automotive PoC, with mass production starting in March 2025.
20
'25
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TDK News
Experience the future of power solutions with TDK at APEC 2025
Technologies range within the power electronics industry, including innovations for variable frequency drives, infrastructure power, automotive applications, and more.
20
'25
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NXP News
NXP presents the FRDM i.MX 91 Development Board
Built around the i.MX 91 applications processor, this board is designed to accelerate industrial and IoT development, offering a cost-effective, secure and connectivity-rich platform.
20
'25
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Texas Instruments News
TI presents new power management chips for modern data centers
The industry's first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.
20
'25
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Omron Components News
Omron's new high-temperature relay permits denser board designs
The G3VM S-VSON(L) MOS FET relay is capable of operating at ambient temperatures of up to 125˚C, improving on previous iterations which were limited to ambient temperatures of 110˚C.
19
'25
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Mitsubishi Electric News
