19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

Lanner Electronics

Lanner Unveils Rugged Edge AI Computers at NVIDIA GTC 2025, Powered by NVIDIA Jetson AGX Orin

Lanner Electronics, a global leader in network computing appliance and industrial AI computers, will officially unveil its latest innovation, the EAI-I233 and EAI-I251 industrial-grade Edge AI computers, at NVIDIA GTC 2025.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

Kontron News

JUMPtec expands its strategic solution portfolio with Texas Instruments processors

JUMPtec announces a new SMARC module based on TI’s AM67A scalable edge AI processor, which integrates up to four Arm Cortex A53 CPU cores at 1.4-GHz, a 4 TOPS neural processing unit (NPU) and an extensive suite of on-device accelerators.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon unveils next generation of high-density power modules for vertical power delivery (VPD) in AI data centers

Infineon Technologies AG global semiconductor leader in power systems and IoT, launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

Congatec News

congatec heat pipe cooling solution for extreme environmental conditions

congatec premiered its heat pipe cooling solution for extreme environmental conditions at embedded world 2025.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

Micron News

Micron Innovates From the Data Center to the Edge With NVIDIA

Micron Technology leads memory innovation, becoming the first to ship both HBM3E and SOCAMM products, enhancing AI server performance in data centers with LPDDR solutions.

Read more…

18 {{ "2025-03-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-18T00:00:00+00:00" | date "longDate" }}

Kyocera News

KYOCERA AVX Unveils World’s First 47μF MLCC in 0402 Size

KYOCERA AVX’s 47µF MLCC in 0402 size supports AI servers, smartphones, and wearables by enabling miniaturization, high reliability, and efficient power management.

Read more…

18 {{ "2025-03-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-18T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

EMV 2025: Rohde & Schwarz presents new antenna for EMI measurements in frequency range from 14.9 GHz to 44 GHz

At the EMV 2025 tradeshow in Stuttgart, Rohde & Schwarz displays for the first time its R&S HF1444G14 High-gain EMI microwave antenna with outstanding performance.

Read more…

18 {{ "2025-03-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-18T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Enables Dynamic Test on a Wide-Bandgap Power Semiconductor Bare Chip

Easily and accurately measure dynamic characteristics on a Wide-Bandgap power semiconductor bare chip without soldering or probe needles.

Read more…

18 {{ "2025-03-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-18T00:00:00+00:00" | date "longDate" }}

BASLER News

Smart image processing in dynamic environments

Resistant to vibrations up to 5 g and shocks up to 50 g, the Basler Stereo visard camera reliably checks components and products for defects.

Read more…

17 {{ "2025-03-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-17T00:00:00+00:00" | date "longDate" }}

Texas Instruments News

TI introduces the world's smallest MCU, enabling innovation in the tiniest of applications

TI introduces a groundbreaking MCU, 38% smaller than existing models, designed to enhance space efficiency, performance, and power optimization in compact electronics.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Lanner Unveils Rugged Edge AI Computers at NVIDIA GTC 2025, Powered by NVIDIA Jetson AGX Orin

Lanner Electronics, a global leader in network computing appliance and industrial AI computers, will officially unveil its latest innovation, the EAI-I233 and EAI-I251 industrial-grade Edge AI computers, at NVIDIA GTC 2025.

JUMPtec expands its strategic solution portfolio with Texas Instruments processors

JUMPtec announces a new SMARC module based on TI’s AM67A scalable edge AI processor, which integrates up to four Arm Cortex A53 CPU cores at 1.4-GHz, a 4 TOPS neural processing unit (NPU) and an extensive suite of on-device accelerators.

Infineon unveils next generation of high-density power modules for vertical power delivery (VPD) in AI data centers

Infineon Technologies AG global semiconductor leader in power systems and IoT, launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute.

congatec heat pipe cooling solution for extreme environmental conditions

congatec premiered its heat pipe cooling solution for extreme environmental conditions at embedded world 2025.

Micron Innovates From the Data Center to the Edge With NVIDIA

Micron Technology leads memory innovation, becoming the first to ship both HBM3E and SOCAMM products, enhancing AI server performance in data centers with LPDDR solutions.

KYOCERA AVX Unveils World’s First 47μF MLCC in 0402 Size

KYOCERA AVX’s 47µF MLCC in 0402 size supports AI servers, smartphones, and wearables by enabling miniaturization, high reliability, and efficient power management.

EMV 2025: Rohde & Schwarz presents new antenna for EMI measurements in frequency range from 14.9 GHz to 44 GHz

At the EMV 2025 tradeshow in Stuttgart, Rohde & Schwarz displays for the first time its R&S HF1444G14 High-gain EMI microwave antenna with outstanding performance.

Keysight Enables Dynamic Test on a Wide-Bandgap Power Semiconductor Bare Chip

Easily and accurately measure dynamic characteristics on a Wide-Bandgap power semiconductor bare chip without soldering or probe needles.

Smart image processing in dynamic environments

Resistant to vibrations up to 5 g and shocks up to 50 g, the Basler Stereo visard camera reliably checks components and products for defects.

TI introduces the world's smallest MCU, enabling innovation in the tiniest of applications

TI introduces a groundbreaking MCU, 38% smaller than existing models, designed to enhance space efficiency, performance, and power optimization in compact electronics.

International