17
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Southco. Inc.
17
'25
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Kontron News
Kontron's new modular Ethernet switch module KSwitch M20
Modular, non-blocking and fully-managed 100Gb/s Ethernet switch module with Precision Time Protocol and extensive feature set.
17
'25
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AMD News
AMD launches 5th Gen EPYC processors for networking, storage, edge markets
High-performance “Zen 5” architecture offers server-grade performance and efficiency combined with purpose-built features for optimized product longevity and system resiliency.
17
'25
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Infineon News
Accelerating and simplifying software development: Infineon launches Drive Core
Infineon Technologies AG is launching Drive Core, a scalable software bundle portfolio for AURIX, TRAVEO and PSOC that facilitates a rapid start into automotive software development.
17
'25
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STMicroelectronics News
STMicroelectronics explores how innovations in battery management systems are driving the re-purposing of EV batteries
The EV revolution aims to cut emissions, with 350m EVs expected by 2030. Sustainable battery lifecycles are crucial for long-term green transition and reducing environmental impact.
17
'25
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Rohde & Schwarz
Rohde & Schwarz launches R&S NRP140TWG(N) thermal power sensor: A new benchmark for F band applications
Rohde & Schwarz presents the new R&S NRP140TWG(N) thermal power sensor, designed to meet the growing demands of applications in the F band utilizing a WR 8 waveguide connector.
14
'25
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Qualcomm News
Qualcomm, Palantir Extend AI & Ontology to Edge for Smarter Industrial IoT
Palantir’s AI and Ontology run on Qualcomm’s edge computing platforms, enable real-time insights, automation, and smarter decisions in industrial and automotive sectors.
14
'25
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Renesas News
Renesas Expands Mid-Class AI Processor Line with RZ/V2N for Smart Factories & Cities
The RZ/V2N enables energy-efficient AI for smart factories and cities, optimizing traffic analysis, visual inspection, and driver monitoring with low power consumption.
14
'25
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Fischer Elektronik News
New heatsinks from Fischer Elektronik
The new heat sink designs SK 706, SK 707, SK 708 and SK 709 are thermally optimised for free convection in terms of base and fin thickness as well as fin spacing and height.
14
'25
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Toshiba News
