06 {{ "2025-03-06T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-06T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Launches VeloSky to Deliver Network Convergence, Transform Connectivity

New Enhanced Fixed Wireless Access Solution Enables Communications Service Providers to Deliver AI-Optimized Performance, Seamless Availability, and Integrated Security.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-05T00:00:00+00:00" | date "longDate" }}

Intel News

Intel Xeon 6 to Prove Foundational to Network Infrastructure at MWC 2025

Intel Xeon 6 SoC enhances RAN capacity by 2.4x, AI performance by 3.2x, and efficiency by 70%, with broad 5G ecosystem adoption.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-05T00:00:00+00:00" | date "longDate" }}

Telit News

Telit Cinterion Launches AI-Powered 5G Modules & Data Cards with Qualcomm’s Cutting-Edge Modem

The FE990D and FN990D, AI-powered 5G modules with Qualcomm X85/82, supports 3GPP Release 18 for FWA, networking, broadcasting, and satellite communication.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-05T00:00:00+00:00" | date "longDate" }}

TDK News

TDK adds full telemetry to new DC-DC converter modules for high power-density applications

The FS1606 offers 6A power, full telemetry via I²C, and a temperature range support between -40°C to 125°C in a compact 3.3 x 3.3 x 1.35 mm module.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-05T00:00:00+00:00" | date "longDate" }}

MIkroe News

MIKROE Unveils LTE IoT 10 Click Board for Global LTE-M and NB-IoT Solutions

Powered by Sequans’ Monarch GM02S module, this dual-mode board supports smart cities, wearables, and industrial IoT with seamless, low-power connectivity.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-05T00:00:00+00:00" | date "longDate" }}

Tria Technologies News

Tria will launch five new product families powered by Qualcomm at Embedded World

Tria Technologies, an Avnet company specializing in embedded computing boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon^® platforms at its Embedded World debut.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-05T00:00:00+00:00" | date "longDate" }}

Aetina

Aetina Unveils Cutting-Edge Edge AI Solutions with Agentic AI at GTC 2025

Aetina will showcase its groundbreaking SuperEdge AEX-2UA1 NVIDIA MGX server and NVIDIA Jetson Orin series solutions at GTC 2025 from March 17 to 21 at Booth No. 238.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-05T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

Rohde & Schwarz and Ceva present industry’s first test solution for the upcoming Bluetooth^® OTA UTP Test Mode

The next Bluetooth^® release is expected to be ratified soon. One important new feature is the Unified Test Protocol (UTP) Test Mode for Bluetooth^® Low Energy, that will complement existing test methods.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-05T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight and Ericsson Collaborate to Establish Pre-6G Test Setup Using Centimeter Wave Spectrum

The testbed establishes a cmWave communication link between an Ericsson pre-6G base station and test user equipment (UE) from Keysight.

Read more…

04 {{ "2025-03-04T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-04T00:00:00+00:00" | date "longDate" }}

TDK News

TDK Expands ZWS-C Power Supply Series with Enhanced Mounting and Protection Features

TDK introduces new configurations for its ZWS-C industrial AC-DC power supplies, adding L-brackets, PCB pins, and board coatings to improve flexibility and durability in automation, robotics, and test equipment.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Broadcom Launches VeloSky to Deliver Network Convergence, Transform Connectivity

New Enhanced Fixed Wireless Access Solution Enables Communications Service Providers to Deliver AI-Optimized Performance, Seamless Availability, and Integrated Security.

Intel Xeon 6 to Prove Foundational to Network Infrastructure at MWC 2025

Intel Xeon 6 SoC enhances RAN capacity by 2.4x, AI performance by 3.2x, and efficiency by 70%, with broad 5G ecosystem adoption.

Telit Cinterion Launches AI-Powered 5G Modules & Data Cards with Qualcomm’s Cutting-Edge Modem

The FE990D and FN990D, AI-powered 5G modules with Qualcomm X85/82, supports 3GPP Release 18 for FWA, networking, broadcasting, and satellite communication.

TDK adds full telemetry to new DC-DC converter modules for high power-density applications

The FS1606 offers 6A power, full telemetry via I²C, and a temperature range support between -40°C to 125°C in a compact 3.3 x 3.3 x 1.35 mm module.

MIKROE Unveils LTE IoT 10 Click Board for Global LTE-M and NB-IoT Solutions

Powered by Sequans’ Monarch GM02S module, this dual-mode board supports smart cities, wearables, and industrial IoT with seamless, low-power connectivity.

Tria will launch five new product families powered by Qualcomm at Embedded World

Tria Technologies, an Avnet company specializing in embedded computing boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon^® platforms at its Embedded World debut.

Aetina Unveils Cutting-Edge Edge AI Solutions with Agentic AI at GTC 2025

Aetina will showcase its groundbreaking SuperEdge AEX-2UA1 NVIDIA MGX server and NVIDIA Jetson Orin series solutions at GTC 2025 from March 17 to 21 at Booth No. 238.

Rohde & Schwarz and Ceva present industry’s first test solution for the upcoming Bluetooth^® OTA UTP Test Mode

The next Bluetooth^® release is expected to be ratified soon. One important new feature is the Unified Test Protocol (UTP) Test Mode for Bluetooth^® Low Energy, that will complement existing test methods.

Keysight and Ericsson Collaborate to Establish Pre-6G Test Setup Using Centimeter Wave Spectrum

The testbed establishes a cmWave communication link between an Ericsson pre-6G base station and test user equipment (UE) from Keysight.

TDK Expands ZWS-C Power Supply Series with Enhanced Mounting and Protection Features

TDK introduces new configurations for its ZWS-C industrial AC-DC power supplies, adding L-brackets, PCB pins, and board coatings to improve flexibility and durability in automation, robotics, and test equipment.

International

Market Overview

Technical Articles

Case studies

New Enhanced Fixed Wireless Access Solution Enables Communications Service Providers to Deliver AI-Optimized Performance, Seamless Availability, and Integrated Security.

Intel Xeon 6 SoC enhances RAN capacity by 2.4x, AI performance by 3.2x, and efficiency by 70%, with broad 5G ecosystem adoption.

The FE990D and FN990D, AI-powered 5G modules with Qualcomm X85/82, supports 3GPP Release 18 for FWA, networking, broadcasting, and satellite communication.

The FS1606 offers 6A power, full telemetry via I²C, and a temperature range support between -40°C to 125°C in a compact 3.3 x 3.3 x 1.35 mm module.

Powered by Sequans’ Monarch GM02S module, this dual-mode board supports smart cities, wearables, and industrial IoT with seamless, low-power connectivity.

Tria Technologies, an Avnet company specializing in embedded computing boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon® platforms at its Embedded World debut.

Aetina will showcase its groundbreaking SuperEdge AEX-2UA1 NVIDIA MGX server and NVIDIA Jetson Orin series solutions at GTC 2025 from March 17 to 21 at Booth No. 238.

The next Bluetooth® release is expected to be ratified soon. One important new feature is the Unified Test Protocol (UTP) Test Mode for Bluetooth® Low Energy, that will complement existing test methods.

The testbed establishes a cmWave communication link between an Ericsson pre-6G base station and test user equipment (UE) from Keysight.

TDK introduces new configurations for its ZWS-C industrial AC-DC power supplies, adding L-brackets, PCB pins, and board coatings to improve flexibility and durability in automation, robotics, and test equipment.

International

Tria Technologies, an Avnet company specializing in embedded computing boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon^® platforms at its Embedded World debut.

The next Bluetooth^® release is expected to be ratified soon. One important new feature is the Unified Test Protocol (UTP) Test Mode for Bluetooth^® Low Energy, that will complement existing test methods.