01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26

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Keysight technologies News

Keysight and WIN Semiconductors Launch Joint GaN MMIC Workflow

Keysight Technologies and WIN Semiconductors connect on-chip simulation and evaluation board design to enable first-pass GaN MMIC tapeout success.

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01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-07-01T00:00:00+00:00" | date "longDate" }}

binder Connector News

binder transforms components into intelligent systems through printed electronics

By directly integrating functional layers onto surfaces, binder enables a new era of compact and highly integrated device architectures.

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30 {{ "2026-06-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-30T00:00:00+00:00" | date "longDate" }}

Wooptix News

Integration of wavefront phase imaging into semiconductor metrology

Wooptix installs automated inspection platform at CEA-Leti to advance nanotopography research.

Read more…

30 {{ "2026-06-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-30T00:00:00+00:00" | date "longDate" }}

AMD News

AMD's systems-on-chip integrate memory directly

New AMD's SoC integrates up to 32GB of LPDDR5X memory, delivering higher bandwidth, reduced board area and accelerated system development.

Read more…

29 {{ "2026-06-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-29T00:00:00+00:00" | date "longDate" }}

Melexis News

Digital current sensing optimizes signal integrity in automotive traction inverters

Melexis introduces a digital output current sensor to mitigate electromagnetic interference within high-power electric vehicle powertrains.

Read more…

29 {{ "2026-06-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-29T00:00:00+00:00" | date "longDate" }}

Kvaser AB

Introducing the Kvaser PCIe 4xLIN for next-level LIN connectivity

Designed for desktop, industrial, and HIL environments, the low-profile PCIe card integrates galvanic isolation with synchronized timestamping, giving engineers reliable, system-level visibility when testing and debugging LIN networks.

Read more…

25 {{ "2026-06-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-25T00:00:00+00:00" | date "longDate" }}

Broadcom News

OpenAI and Broadcom Unveil LLM-Optimized Intelligence Processor

OpenAI and Broadcom collaborate to engineer and deploy Jalapeño, a custom artificial intelligence processor optimized for large language model inference workloads.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Anritsu News

5G RedCap Device Application Evaluation Solutions for Cellular Network Testing

Anritsu Corporation launched enhanced application evaluation solutions to streamline wireless performance testing for the growing 5G market.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung Introduces Fastest UFS 5.0 Storage for Next-Generation Mobile AI

New memory solution delivers higher speeds, improved efficiency, and compact designs for smartphones, wearables, and XR devices.

Read more…

24 {{ "2026-06-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-24T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Nanocrystalline cable cores for effective EMC interference suppression

The new WE-NCC series complements conventional ferrite cores, offering compact, temperature-stable, and broadband solutions designed specifically for modern power electronics and system reliability.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Keysight and WIN Semiconductors Launch Joint GaN MMIC Workflow

Keysight Technologies and WIN Semiconductors connect on-chip simulation and evaluation board design to enable first-pass GaN MMIC tapeout success.

binder transforms components into intelligent systems through printed electronics

By directly integrating functional layers onto surfaces, binder enables a new era of compact and highly integrated device architectures.

Integration of wavefront phase imaging into semiconductor metrology

Wooptix installs automated inspection platform at CEA-Leti to advance nanotopography research.

AMD's systems-on-chip integrate memory directly

New AMD's SoC integrates up to 32GB of LPDDR5X memory, delivering higher bandwidth, reduced board area and accelerated system development.

Digital current sensing optimizes signal integrity in automotive traction inverters

Melexis introduces a digital output current sensor to mitigate electromagnetic interference within high-power electric vehicle powertrains.

Introducing the Kvaser PCIe 4xLIN for next-level LIN connectivity

Designed for desktop, industrial, and HIL environments, the low-profile PCIe card integrates galvanic isolation with synchronized timestamping, giving engineers reliable, system-level visibility when testing and debugging LIN networks.

OpenAI and Broadcom Unveil LLM-Optimized Intelligence Processor

OpenAI and Broadcom collaborate to engineer and deploy Jalapeño, a custom artificial intelligence processor optimized for large language model inference workloads.

5G RedCap Device Application Evaluation Solutions for Cellular Network Testing

Anritsu Corporation launched enhanced application evaluation solutions to streamline wireless performance testing for the growing 5G market.

Samsung Introduces Fastest UFS 5.0 Storage for Next-Generation Mobile AI

New memory solution delivers higher speeds, improved efficiency, and compact designs for smartphones, wearables, and XR devices.

Nanocrystalline cable cores for effective EMC interference suppression

The new WE-NCC series complements conventional ferrite cores, offering compact, temperature-stable, and broadband solutions designed specifically for modern power electronics and system reliability.

International