04
'26
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Nvidia News
03
'26
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Signal Hound
Signal Hound Adds Pulse Analysis Tool Kit to Spike
New Spike software adds advanced pulse and radar analysis with automatic signal characterization, deinterleaving, correlation testing, and deep pulse memory.
03
'26
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Aspeed
ASPEED and Cupola360 Showcase Integrated Data Center Management, Security and Reality Remote Management Solutions at COMPUTEX 2026
ASPEED introduces its AST1840 SMC+eFPGA platform and Caliptra 2.x-enabled security portfolio, while Cupola360 presents AI-powered Reality Remote Management solutions combining panoramic vision, IoT control and intelligent inspection technologies for enterprise operations.
03
'26
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Anritsu News
Verification of Lower Layer Triggered Mobility for 5G Networks
Anritsu introduces test cases for 3GPP Release 18 to minimize handover interruption in time-critical communication and extended reality applications.
03
'26
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Infineon News
Contactless Payment Tokenization Integration for Active Smart Wearables
Infineon Technologies has developed a ready-to-integrate hardware and software architecture to enable digital card tokenization and near-field communication transactions on wearable computing devices.
02
'26
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BenQ
BenQ Qisda Group Highlights Practical AI Applications and Ecosystem Integration at COMPUTEX 2026
Through four business categories, the Group presents how AI is being deployed across industries to improve productivity, operational efficiency, and decision-making.
02
'26
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Keysight technologies News
Keysight Collaborates With NTT DOCOMO and NTT on 6G Modeling
Keysight Technologies partners with NTT DOCOMO and NTT to accelerate realistic 6G channel modeling and distributed MIMO wireless communication simulations.
01
'26
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STMicroelectronics News
Automotive inertial module improves GNSS positioning accuracy
STMicroelectronics introduces a high-temperature automotive IMU combining synchronized MEMS sensing and sensor fusion support for navigation, telematics and vehicle motion analysis.
01
'26
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Samsung News
HBM4E memory samples target next-generation AI infrastructure
Samsung Electronics begins shipment of 12-layer HBM4E samples with higher bandwidth, improved energy efficiency and expanded memory capacity for AI computing platforms.
01
'26
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Altech Corporation
