01
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CEA Leti News
01
'26
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Microchip News
Microchip Introduces Cost-Optimized Real-Time Control DSCs
The new controller family targets embedded control applications by combining deterministic processing, integrated analog functions, and automotive-grade reliability in a single device.
01
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AEWIN Technologies
Rack-Scale AI Meets Advanced Liquid Cooling
AEWIN combines high-density computing, storage, and thermal management to support growing AI infrastructure demands.
30
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MICRO EPSILON News
Vacuum Sensor Technology for High-Precision Industrial Measurement Tasks
Micro-Epsilon configures non-contact sensors for measurements in the semiconductor industry, optics, and aviation.
30
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AEWIN Technologies
AEWIN Showcases Next-Gen AI Infrastructure Platforms at COMPUTEX 2026
Featuring Intel Xeon 6 and AMD EPYC 9005 platforms, AEWIN delivers high-performance computing, networking, and storage solutions for secure and scalable AI deployments.
29
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Aaronn Electronic GmbH news
Scalable ARM Performance in a COM-HPC Mini Module
Aaronn Electronic introduces the congatec conga-HPC/mIQ-X, a COM-HPC Mini module designed for edge AI, machine vision, and industrial automation applications.
29
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TDK News
3D Hall-Effect Sensor for Automotive Motion Control
TDK introduces the HAL 13xy sensor family for speed and direction detection in automotive and industrial systems.
29
'26
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Rohm Semiconductors News
ROHM Launches Web-Based Power Electronics Simulation Tool
A browser-based platform for rapid loss and thermal analysis helps engineers evaluate power semiconductor choices before hardware prototyping.
29
'26
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Diodes Incorporated News
Automotive USB Type-C Charging Controller for 140W Power Delivery
Diodes Incorporated combines USB PD3.1 source control and synchronous buck regulation to reduce component count in vehicle charging architectures.
28
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Kontron News
