23 {{ "2026-06-23T00:00:00+00:00" | date "MMM" }} '26

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STMicroelectronics News

Direct Time-of-Flight 3D LiDAR Module for Edge Systems

STMicroelectronics introduces a high-resolution 3D sensing module providing depth mapping and spatial awareness for robotics, industrial automation, and smart infrastructure.

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19 {{ "2026-06-19T00:00:00+00:00" | date "MMM" }} '26

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Würth Elektronik News

Nanocrystalline EMC absorber foils for flexible enclosure shielding

The WE-FNCS nanocrystalline foil developed by Würth Elektronik offers a highly flexible solution for suppressing low-frequency electromagnetic interference (EMI) in electronic devices.

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19 {{ "2026-06-19T00:00:00+00:00" | date "MMM" }} '26

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Rutronik News

Precise Distance Measurement for Short-Range Wireless Sensor Networks

Rutronik introduces a compact hardware platform leveraging the latest Bluetooth positioning standards to enable efficient asset tracking without complex ultra-wideband architectures.

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18 {{ "2026-06-18T00:00:00+00:00" | date "MMM" }} '26

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Keysight technologies News

Integration of System-Level Simulation in Photonic Design Automation

Keysight Technologies integrates newly acquired VPIphotonics software suites to enable unified electrical-optical-electrical link validation for high-performance data center infrastructure.

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17 {{ "2026-06-17T00:00:00+00:00" | date "MMM" }} '26

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Kontron News

Integrated Processor Architecture Deployment for Edge AI Platforms

Kontron incorporates Core Ultra Series 3 processors into embedded computing boards to consolidate neural processing tasks in space-constrained industrial environments.

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17 {{ "2026-06-17T00:00:00+00:00" | date "MMM" }} '26

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Qualcomm News

Qualcomm Launches a Platform for AI-Powered Spatial Computing

Designed for next-generation XR devices, Snapdragon Reality Elite delivers on-device GenAI, enhanced graphics performance, and extended battery life for immersive mixed reality experiences.

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15 {{ "2026-06-15T00:00:00+00:00" | date "MMM" }} '26

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DMSC, Inc

DMSC Model-Based Characteristics Standard Approved as American National Standard

ANSI Approval Marks Major Milestone for Digital Manufacturing and Model-Based Enterprise Adoption.

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15 {{ "2026-06-15T00:00:00+00:00" | date "MMM" }} '26

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CEA Leti News

Advancing Semiconductor Energy Efficiency Through Joint Microelectronics Research

A strategic microelectronics partnership between CEA-Leti and GlobalFoundries focuses on developing next-generation fully depleted silicon-on-insulator technology within the FAMES Pilot Line framework.

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12 {{ "2026-06-12T00:00:00+00:00" | date "MMM" }} '26

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Melexis News

Traction Inverters with Integrated Current Sensing

Finest integrates Melexis Hall and IMC-Hall current sensing technologies directly onto inverter control boards to optimize power delivery, maximize battery efficiency, and extend electric vehicle range.

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