23
'26
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MURATA News
22
'26
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Microchip News
Microchip integrates programmable logic into low-power microcontrollers
CLB-based PIC MCUs combine hardware logic and embedded control to reduce latency, improve determinism and simplify timing-critical system design.
22
'26
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Rohm Semiconductors News
ROHM introduces 5th generation SiC MOSFETs for efficiency
New devices reduce on-resistance by 30% at high temperatures, improving power conversion in EVs, AI servers, and industrial systems.
22
'26
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Congatec News
Low-Power Computer-on-Modules Integrate Dedicated Neural Processing Units
Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.
22
'26
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Intel News
Scalable Mobile Processors for Enhanced Edge and Commercial Computing
Intel has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.
21
'26
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SK Hynix News
SK hynix advances AI servers with 192GB SOCAMM2 memory
High-density LPDDR5X module improves bandwidth and power efficiency for NVIDIA Vera Rubin platforms, addressing AI memory bottlenecks.
16
'26
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Thales Group News
Thales Develops Compact PNT Receiver for Defense
New receiver integrates GNSS resilience, anti-jamming, and timing functions to maintain navigation and communication in electronic warfare scenarios.
16
'26
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Tria Technologies News
Tria Technologies Introduces COM-HPC Module with Edge AI Acceleration
New module integrates Intel processors with onboard AI acceleration to support real-time edge computing in industrial automation and robotics environments.
16
'26
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Altech Corporation
Altech expands its range of 60 A pins and sleeves.
Altech Expands its IEC 60309 Series II portfolio with 60A pin and sleeve sevices.
16
'26
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TDK News
