26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

MICRO EPSILON News

Inline Wafer Thickness Measurement in Confined Environments

Micro-Epsilon introduces a robust interferometric sensor enabling precise inline thickness measurement of silicon and silicon carbide wafers in high-contamination production processes.

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25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Introduces Hybrid MCU SiP for Automotive HMIs

Integrated processor and memory architecture supports high-resolution displays and simplifies PCB design for automotive and e-mobility interface systems.

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25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Anritsu News

AI Optimizes Antenna Performance in Real-World Conditions

Anritsu, SK Telecom, Postech and Bluetest validated AI-driven antenna optimization using OTA measurements, demonstrating throughput gains in 5G MIMO configurations.

Read more…

24 {{ "2026-03-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-24T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Starts China-Based STM32 MCU Production

Localized 40 nm microcontroller manufacturing enables dual supply chain resilience and consistent performance for electronics applications across China.

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23 {{ "2026-03-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-23T00:00:00+00:00" | date "longDate" }}

NXP News

Imaging Radar Transceiver Advances ADAS Performance

NXP Semiconductors introduces an RFCMOS radar transceiver to enable scalable high-resolution imaging radar for Level 2+ to Level 4 automated driving.

Read more…

23 {{ "2026-03-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-23T00:00:00+00:00" | date "longDate" }}

Renesas News

GaN Power Conversion Enables 500W Charging Systems

Renesas Electronics introduces a GaN-based HWLLC platform to improve power density and efficiency in industrial and IoT power supply applications.

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23 {{ "2026-03-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-23T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

GaN Motor Control Reference Design for Compact High-Power Drives

STMicroelectronics introduces a GaN-based motor control platform to support efficient appliance motors and industrial automation drives with reduced thermal management requirements.

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23 {{ "2026-03-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-23T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

THz Signal Analysis Supports Next-Generation Data Center Interconnects

Keysight enhances 89600 VSA software to enable AttoTude’s terahertz interconnect development for AI and hyperscale data center infrastructure.

Read more…

21 {{ "2026-03-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-21T00:00:00+00:00" | date "longDate" }}

Bosch Rexroth News

Precision Resistance Welding Control for Micro Applications

Bosch Rexroth introduces the PXC7100 control system for low-current resistance welding, enabling precise splice compacting and sensor or battery joining in industrial applications.

Read more…

20 {{ "2026-03-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-20T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba enhances SMPS efficiency with 600V super junction MOSFETs

DTMOSVI series integrates fast-recovery diodes and reduced switching losses for compact, high-efficiency power supply designs.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Inline Wafer Thickness Measurement in Confined Environments

Micro-Epsilon introduces a robust interferometric sensor enabling precise inline thickness measurement of silicon and silicon carbide wafers in high-contamination production processes.

Microchip Introduces Hybrid MCU SiP for Automotive HMIs

Integrated processor and memory architecture supports high-resolution displays and simplifies PCB design for automotive and e-mobility interface systems.

AI Optimizes Antenna Performance in Real-World Conditions

Anritsu, SK Telecom, Postech and Bluetest validated AI-driven antenna optimization using OTA measurements, demonstrating throughput gains in 5G MIMO configurations.

STMicroelectronics Starts China-Based STM32 MCU Production

Localized 40 nm microcontroller manufacturing enables dual supply chain resilience and consistent performance for electronics applications across China.

Imaging Radar Transceiver Advances ADAS Performance

NXP Semiconductors introduces an RFCMOS radar transceiver to enable scalable high-resolution imaging radar for Level 2+ to Level 4 automated driving.

GaN Power Conversion Enables 500W Charging Systems

Renesas Electronics introduces a GaN-based HWLLC platform to improve power density and efficiency in industrial and IoT power supply applications.

GaN Motor Control Reference Design for Compact High-Power Drives

STMicroelectronics introduces a GaN-based motor control platform to support efficient appliance motors and industrial automation drives with reduced thermal management requirements.

THz Signal Analysis Supports Next-Generation Data Center Interconnects

Keysight enhances 89600 VSA software to enable AttoTude’s terahertz interconnect development for AI and hyperscale data center infrastructure.

Precision Resistance Welding Control for Micro Applications

Bosch Rexroth introduces the PXC7100 control system for low-current resistance welding, enabling precise splice compacting and sensor or battery joining in industrial applications.

Toshiba enhances SMPS efficiency with 600V super junction MOSFETs

DTMOSVI series integrates fast-recovery diodes and reduced switching losses for compact, high-efficiency power supply designs.

International