20 {{ "2026-03-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-20T00:00:00+00:00" | date "longDate" }}

Microchip News

SiC Power Modules Improve Reliability in Harsh Environments

Microchip introduces BZPACK mSiC modules designed for HV-H3TRB compliance, enabling durable and efficient power conversion in industrial and renewable energy systems.

Read more…

20 {{ "2026-03-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-20T00:00:00+00:00" | date "longDate" }}

Broadcom News

PQC Network Encryption Secures Fibre Channel Data Transfers

Broadcom launches end-to-end post-quantum cryptography solution with Emulex SecureHBA, enabling in-flight data protection across enterprise storage networks.

Read more…

20 {{ "2026-03-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-20T00:00:00+00:00" | date "longDate" }}

Vishay News

Vishay Unveils Space-Grade EMI Choke

Vishay Intertechnology introduces rugged common mode choke for GaN and SiC power applications.

Read more…

19 {{ "2026-03-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-19T00:00:00+00:00" | date "longDate" }}

Exxelia

Exxelia Releases New White Paper: Navigating ESCC 3201 vs. MIL-STD-981 for Space-Grade Magnetic Components

How do ESCC 3201 and MIL-STD-981 really compare when it comes to space-grade inductors?.

Read more…

19 {{ "2026-03-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-19T00:00:00+00:00" | date "longDate" }}

AMD News

Samsung Advances AI Infrastructure with HBM4 Memory Collaboration

Partnership with AMD focuses on high-bandwidth memory and DDR5 solutions to improve performance, efficiency, and scalability in AI and data center systems.

Read more…

19 {{ "2026-03-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-19T00:00:00+00:00" | date "longDate" }}

Toshiba News

Photocoupler Enables High-Voltage Automotive SSR Design

Toshiba introduces TLX9920 photovoltaic-output photocoupler to support solid state relay performance in automotive, energy storage, and industrial power systems.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

TDK News

MOSFET ORing Modules Improve Power Redundancy Efficiency

TDK Corporation introduces compact MOSFET-based ORing modules designed to enhance power redundancy and reduce losses in industrial and communication systems.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Synopsis News

Electronics digital twins support software-defined system development

Synopsys presents a cloud-enabled development platform for virtual validation of automotive and physical AI systems within complex semiconductor and software ecosystems.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung Advances AI Memory With HBM4E & LPDDR6

These new high-bandwidth memory and low-power DRAM solutions target scalable AI infrastructures, edge computing, and data centers.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

innodisk

Solutions presented by Innodisk at NVIDIA GTC 2026

At NVIDIA GTC 2026, alongside subsidiary Aetina, Innodisk is showcasing the seamless integration of NVIDIA AI architectures into scalable, deployable edge AI applications.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

SiC Power Modules Improve Reliability in Harsh Environments

Microchip introduces BZPACK mSiC modules designed for HV-H3TRB compliance, enabling durable and efficient power conversion in industrial and renewable energy systems.

PQC Network Encryption Secures Fibre Channel Data Transfers

Broadcom launches end-to-end post-quantum cryptography solution with Emulex SecureHBA, enabling in-flight data protection across enterprise storage networks.

Vishay Unveils Space-Grade EMI Choke

Vishay Intertechnology introduces rugged common mode choke for GaN and SiC power applications.

Exxelia Releases New White Paper: Navigating ESCC 3201 vs. MIL-STD-981 for Space-Grade Magnetic Components

How do ESCC 3201 and MIL-STD-981 really compare when it comes to space-grade inductors?.

Samsung Advances AI Infrastructure with HBM4 Memory Collaboration

Partnership with AMD focuses on high-bandwidth memory and DDR5 solutions to improve performance, efficiency, and scalability in AI and data center systems.

Photocoupler Enables High-Voltage Automotive SSR Design

Toshiba introduces TLX9920 photovoltaic-output photocoupler to support solid state relay performance in automotive, energy storage, and industrial power systems.

MOSFET ORing Modules Improve Power Redundancy Efficiency

TDK Corporation introduces compact MOSFET-based ORing modules designed to enhance power redundancy and reduce losses in industrial and communication systems.

Electronics digital twins support software-defined system development

Synopsys presents a cloud-enabled development platform for virtual validation of automotive and physical AI systems within complex semiconductor and software ecosystems.

Samsung Advances AI Memory With HBM4E & LPDDR6

These new high-bandwidth memory and low-power DRAM solutions target scalable AI infrastructures, edge computing, and data centers.

Solutions presented by Innodisk at NVIDIA GTC 2026

At NVIDIA GTC 2026, alongside subsidiary Aetina, Innodisk is showcasing the seamless integration of NVIDIA AI architectures into scalable, deployable edge AI applications.

International