12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

MIkroe News

Modular MCU Board Accelerates Embedded Prototyping

MIKROE introduces a Renesas-based development board for rapid prototyping using modular sensor and communication interfaces for embedded systems and industrial IoT applications.

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12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Samsung News

Multi-Die Design Frameworks for Advanced Semiconductor Systems

Samsung Foundry and Synopsys collaborate to develop integrated design flows enabling multi-die semiconductor architectures for AI, HPC, and advanced computing applications.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Aetina

Aetina showcases 3D vision and Generative AI at GTC 2026

Aetina presents Jetson Thor platforms and MGX edge servers enabling robotic perception and enterprise AI decision-making at the edge.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Toshiba News

Compact photorelays can withstand high temperatures

Toshiba introduces voltage-driven relays for dense PCB layouts and reliable switching in automotive electronics and measurement environments.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Telit News

5G Gateway Platforms Integrate Localization and Radar

Telit Cinterion and Airfide Networks integrate ultra-wideband positioning and 60 GHz radar sensing with FN990B40-based 5G gateway platforms.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Renesas News

Cloud Platform Integrates Embedded System Design

Renesas launches Renesas 365, a cloud-based platform integrating device selection, system modeling and embedded development workflows.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Synopsys News

Hardware Verification Platforms Target Complex AI Chips

Synopsys expands its hardware-assisted verification portfolio with new ZeBu and HAPS systems designed for large-scale AI chip validation.

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11 {{ "2026-03-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-11T00:00:00+00:00" | date "longDate" }}

iBASE News

Industrial ATX Motherboard for Edge and Automation

IBASE Technology introduces an ATX motherboard supporting Intel Core processors to deliver scalable computing for industrial automation, edge computing, and machine vision applications.

Read more…

11 {{ "2026-03-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-11T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

Technology agenda sealed by letter of intent

IDS and Prophesee deepen collaboration to advance next-generation Event-based industrial vision systems.

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11 {{ "2026-03-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-11T00:00:00+00:00" | date "longDate" }}

Synaptics News

Single-chip Wi-Fi 7 SoC targets edge AI IoT

Synaptics introduces a wireless connectivity and processing platform combining tri-band networking, embedded AI acceleration and sensing capabilities for industrial and consumer IoT devices.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Modular MCU Board Accelerates Embedded Prototyping

MIKROE introduces a Renesas-based development board for rapid prototyping using modular sensor and communication interfaces for embedded systems and industrial IoT applications.

Multi-Die Design Frameworks for Advanced Semiconductor Systems

Samsung Foundry and Synopsys collaborate to develop integrated design flows enabling multi-die semiconductor architectures for AI, HPC, and advanced computing applications.

Aetina showcases 3D vision and Generative AI at GTC 2026

Aetina presents Jetson Thor platforms and MGX edge servers enabling robotic perception and enterprise AI decision-making at the edge.

Compact photorelays can withstand high temperatures

Toshiba introduces voltage-driven relays for dense PCB layouts and reliable switching in automotive electronics and measurement environments.

5G Gateway Platforms Integrate Localization and Radar

Telit Cinterion and Airfide Networks integrate ultra-wideband positioning and 60 GHz radar sensing with FN990B40-based 5G gateway platforms.

Cloud Platform Integrates Embedded System Design

Renesas launches Renesas 365, a cloud-based platform integrating device selection, system modeling and embedded development workflows.

Hardware Verification Platforms Target Complex AI Chips

Synopsys expands its hardware-assisted verification portfolio with new ZeBu and HAPS systems designed for large-scale AI chip validation.

Industrial ATX Motherboard for Edge and Automation

IBASE Technology introduces an ATX motherboard supporting Intel Core processors to deliver scalable computing for industrial automation, edge computing, and machine vision applications.

Technology agenda sealed by letter of intent

IDS and Prophesee deepen collaboration to advance next-generation Event-based industrial vision systems.

Single-chip Wi-Fi 7 SoC targets edge AI IoT

Synaptics introduces a wireless connectivity and processing platform combining tri-band networking, embedded AI acceleration and sensing capabilities for industrial and consumer IoT devices.

International