02 {{ "2026-04-02T00:00:00+00:00" | date "MMM" }} '26

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Power Integrations News

Flyback ICs Extend Power Range to 440 W

Power Integrations introduces TOPSwitchGaN ICs to simplify high-power designs, enabling efficient flyback converters to replace complex resonant topologies in multiple applications.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

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Tria Technologies News

Multi-OS Support for ARM Embedded Systems

Tria Technologies extends Qualcomm-based platforms with Yocto Linux, Windows 11 IoT, and Android to increase flexibility in embedded system design.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Melexis News

Code-Free Three-Phase Motor Driver Simplifies BLDC Design

Melexis introduces MLX80339 to enable fast deployment of efficient, low-noise fan systems without embedded software development.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM expands op amp portfolio for precision electronics

New CMOS op amps target automotive, industrial and consumer applications requiring accurate signal amplification and low-noise analog design.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Congatec News

congatec enables rugged AI computing with Intel Core Ultra COMs

New Computer-on-Modules operate from -40 °C to +85 °C, delivering up to 180 TOPS for edge AI in industrial and mission-critical environments.

Read more…

31 {{ "2026-03-31T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-31T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

7–15 GHz Beamforming ICs for FR3 Networks

Sivers Semiconductors introduces Daybreak chipset to support 5G-Advanced and 6G FR3 deployments in base stations and CPE markets.

Read more…

30 {{ "2026-03-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-30T00:00:00+00:00" | date "longDate" }}

ASMPT News

SIPLACE Platform Drives SMT Innovation at APEX EXPO

ASMPT SMT Solutions showcases new placement technology at APEX EXPO 2026, highlighting demand for high-performance SMT systems in AI and data center applications.

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30 {{ "2026-03-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-30T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Power management ICs for industrial embedded processors

STMicroelectronics introduces PMICs designed to consolidate power supply, monitoring, and protection functions for STM32-based embedded systems in industrial electronics.

Read more…

27 {{ "2026-03-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-27T00:00:00+00:00" | date "longDate" }}

Rutronik News

Thin film resistors for high-precision and stable electronics

Rutronik expands its portfolio with YAGEO’s RP series, delivering enhanced stability, environmental resistance and precision for demanding applications.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

Panasonic Industry News

Panasonic Industry Introduces High-Precision Thick-Film Resistors

ERJPC series delivers 0.1% tolerance and 25 ppm/K TCR with higher power density, enabling compact and cost-efficient designs for automotive and industrial electronics.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Flyback ICs Extend Power Range to 440 W

Power Integrations introduces TOPSwitchGaN ICs to simplify high-power designs, enabling efficient flyback converters to replace complex resonant topologies in multiple applications.

Multi-OS Support for ARM Embedded Systems

Tria Technologies extends Qualcomm-based platforms with Yocto Linux, Windows 11 IoT, and Android to increase flexibility in embedded system design.

Code-Free Three-Phase Motor Driver Simplifies BLDC Design

Melexis introduces MLX80339 to enable fast deployment of efficient, low-noise fan systems without embedded software development.

ROHM expands op amp portfolio for precision electronics

New CMOS op amps target automotive, industrial and consumer applications requiring accurate signal amplification and low-noise analog design.

congatec enables rugged AI computing with Intel Core Ultra COMs

New Computer-on-Modules operate from -40 °C to +85 °C, delivering up to 180 TOPS for edge AI in industrial and mission-critical environments.

7–15 GHz Beamforming ICs for FR3 Networks

Sivers Semiconductors introduces Daybreak chipset to support 5G-Advanced and 6G FR3 deployments in base stations and CPE markets.

SIPLACE Platform Drives SMT Innovation at APEX EXPO

ASMPT SMT Solutions showcases new placement technology at APEX EXPO 2026, highlighting demand for high-performance SMT systems in AI and data center applications.

Power management ICs for industrial embedded processors

STMicroelectronics introduces PMICs designed to consolidate power supply, monitoring, and protection functions for STM32-based embedded systems in industrial electronics.

Thin film resistors for high-precision and stable electronics

Rutronik expands its portfolio with YAGEO’s RP series, delivering enhanced stability, environmental resistance and precision for demanding applications.

Panasonic Industry Introduces High-Precision Thick-Film Resistors

ERJPC series delivers 0.1% tolerance and 25 ppm/K TCR with higher power density, enabling compact and cost-efficient designs for automotive and industrial electronics.

International