The MT40 series combines a compact design with integrated thermal disconnection to protect industrial and energy systems from surge currents up to 50 kA.
The industry's first 32Gb LPDDR5X die enables 1.33x more capacity, 2.3x faster LLM inference, and 3x better efficiency while significantly reducing power and footprint.
Broadcom launches its 3.5D XDSiP platform featuring 2nm technology and 3D-IC integration, enabling Fujitsu and other partners to scale high-performance, low-power XPUs for massive AI.
STMicroelectronics and Qualcomm Technologies integrate motion sensing and secure NFC technologies into the Snapdragon Wear Elite platform to enable low-power AI processing and contactless services in wearable devices.
Hitachi Energy will integrate IGTO technology into high-voltage modules, reducing energy losses by 30 percent to enhance efficiency across renewables, AI, and rail.
PentaG-NTN modem subsystem supports LEO and MEO satellite connectivity and accelerates development of standards-based 5G non-terrestrial network terminals.
AMD introduces the Ryzen AI 400 Series and Ryzen AI PRO 400 Series to provide hardware-accelerated processing for consumer and enterprise desktop computing environments.