20
'26
Written on
TDK News
20
'26
Written on
Keysight technologies News
Keysight Software Targets 3DIC Interconnect Design Bottlenecks
New EDA workflow automates chiplet interconnect modelling and validation to support high-density semiconductor packaging used in AI and data centre hardware.
20
'26
Written on
MURATA News
Murata Expands IoT Ecosystem with Engineering Partners
The ZENCROSSTM Alliance adds development service providers to support scalable low-power IoT deployment across smart infrastructure, logistics and energy applications.
20
'26
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ARROW News
Arrow Electronics Launches Initiative To Advance Next Generation Vehicle Architecture
Arrow Electronics introduced a strategic initiative and research hub providing engineering expertise and supply chain stability to accelerate the development of software-defined vehicle platforms.
20
'26
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Intel News
High-Performance Computing via Intel Xeon 600 Series Workstation Processors
Intel recently introduced the Xeon 600 processor family to enhance computational density and data throughput for professional workstations in the global digital supply chain.
18
'26
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Sivers Semiconductors News
Ka-Band Beamforming ICs for Phased-Array SATCOM Terminals
Sivers Semiconductors targets seamless satellite handover and flat-antenna terminal design in multi-orbit broadband connectivity.
18
'26
Written on
Renesas News
Renesas Introduces 3nm TCAM for Automotive SoCs
Configurable 3nm FinFET TCAM achieves 5.27 Mb/mm² density, 0.167 fJ/bit search energy and enhanced functional safety for automotive and high-speed networking applications.
18
'26
Written on
Toshiba News
Toshiba Introduces 6500V Press Pack IEGT
New 2000A trench-type IEGT supports high-voltage DC transmission, industrial drives and STATCOM systems with improved turn-off capability and compact converter design.
18
'26
Written on
TDK News
High-temperature NTC thermistors expand automotive sensing capabilities
TDK Corporation introduces new NTCSP thermistors designed for conductive-glue mounting and operation up to +175 °C, supporting high-temperature automotive power electronics and advanced sensing applications.
17
'26
Written on
Fraunhofer News
