26 {{ "2026-02-26T00:00:00+00:00" | date "MMM" }} '26

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Toshiba News

Toshiba Launches 135°C-Rated Photorelays

Toshiba introduces four voltage-driven photorelays in a compact S-VSON4T package, designed for high-temperature automotive semiconductor test and burn-in applications.

Read more…

25 {{ "2026-02-25T00:00:00+00:00" | date "MMM" }} '26

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Renesas News

ADAS SoC Integrates Sensor Fusion in SUV Platform

Renesas Electronics Corporation supplies R-Car V4H to Denso for Toyota’s RAV4 TSS(LSS) control unit, enabling integrated camera, radar and driver monitoring functions.

Read more…

25 {{ "2026-02-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-25T00:00:00+00:00" | date "longDate" }}

Kontron News

Compact System-on-Module targets energy-efficient embedded platforms

Kontron Electronics expands its embedded computing portfolio with an OSM-compliant module designed for scalable edge devices, industrial automation, and connected infrastructure applications.

Read more…

25 {{ "2026-02-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-25T00:00:00+00:00" | date "longDate" }}

NXP News

NXP Introduces 10BASE-T1S PMD Transceiver for Edge Ethernet

New automotive and industrial transceivers enable low-cost multi-drop Single Pair Ethernet for software-defined vehicle and industrial architectures.

Read more…

25 {{ "2026-02-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-25T00:00:00+00:00" | date "longDate" }}

AMD News

AMD, Meta Sign 6-GW AI Infrastructure Agreement

Multi-year deployment of AMD Instinct GPUs and EPYC CPUs will power rack-scale AI systems beginning in 2026.

Read more…

24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-24T00:00:00+00:00" | date "longDate" }}

innodisk

Innodisk Launches CXL Add-In Card for Scalable Edge AI Memory Expansion

The new CXL 2.0 Type 3 expansion card delivers flexible DDR5 memory scaling via PCIe Gen 5, addressing latency and space constraints in edge and micro data center environments.

Read more…

24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-24T00:00:00+00:00" | date "longDate" }}

Kyocera News

KYOCERA AVX expands ultra-broadband capacitors to 110 GHz

New MLCC values and higher voltage ratings target signal integrity requirements in optical communications, RF front ends and mmWave electronics.

Read more…

24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-24T00:00:00+00:00" | date "longDate" }}

Teledyne SP Devices

Teledyne SP Devices Introduces 12-bit 10 GSPS Digitizer

ADQ35 delivers dual-channel 5 GSPS sampling, 2.5 GHz bandwidth and GPU streaming up to 14 Gbyte/s for high-speed scientific and industrial data acquisition.

Read more…

23 {{ "2026-02-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-23T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Introduces BroadPeak Radio DFE SoC for 5G Advanced and 6G

Broadcom launches the BroadPeak BCM85021, a 5 nm integrated radio digital front-end SoC targeting massive MIMO and remote radio head applications across 400 MHz to 8.5 GHz.

Read more…

23 {{ "2026-02-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-23T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Technologies Introduces Infiniium XR8 Real-Time Oscilloscope

Keysight launches the Infiniium XR8 with new front-end ASICs and digital engine architecture to accelerate high-speed digital validation and compliance testing.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Toshiba Launches 135°C-Rated Photorelays

Toshiba introduces four voltage-driven photorelays in a compact S-VSON4T package, designed for high-temperature automotive semiconductor test and burn-in applications.

ADAS SoC Integrates Sensor Fusion in SUV Platform

Renesas Electronics Corporation supplies R-Car V4H to Denso for Toyota’s RAV4 TSS(LSS) control unit, enabling integrated camera, radar and driver monitoring functions.

Compact System-on-Module targets energy-efficient embedded platforms

Kontron Electronics expands its embedded computing portfolio with an OSM-compliant module designed for scalable edge devices, industrial automation, and connected infrastructure applications.

NXP Introduces 10BASE-T1S PMD Transceiver for Edge Ethernet

New automotive and industrial transceivers enable low-cost multi-drop Single Pair Ethernet for software-defined vehicle and industrial architectures.

AMD, Meta Sign 6-GW AI Infrastructure Agreement

Multi-year deployment of AMD Instinct GPUs and EPYC CPUs will power rack-scale AI systems beginning in 2026.

Innodisk Launches CXL Add-In Card for Scalable Edge AI Memory Expansion

The new CXL 2.0 Type 3 expansion card delivers flexible DDR5 memory scaling via PCIe Gen 5, addressing latency and space constraints in edge and micro data center environments.

KYOCERA AVX expands ultra-broadband capacitors to 110 GHz

New MLCC values and higher voltage ratings target signal integrity requirements in optical communications, RF front ends and mmWave electronics.

Teledyne SP Devices Introduces 12-bit 10 GSPS Digitizer

ADQ35 delivers dual-channel 5 GSPS sampling, 2.5 GHz bandwidth and GPU streaming up to 14 Gbyte/s for high-speed scientific and industrial data acquisition.

Broadcom Introduces BroadPeak Radio DFE SoC for 5G Advanced and 6G

Broadcom launches the BroadPeak BCM85021, a 5 nm integrated radio digital front-end SoC targeting massive MIMO and remote radio head applications across 400 MHz to 8.5 GHz.

Keysight Technologies Introduces Infiniium XR8 Real-Time Oscilloscope

Keysight launches the Infiniium XR8 with new front-end ASICs and digital engine architecture to accelerate high-speed digital validation and compliance testing.

International