03 {{ "2026-03-03T00:00:00+00:00" | date "MMM" }} '26

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Intel News

Ericsson and Intel Advance AI-Native 6G Collaboration

Partnership announced at MWC 2026 targets AI-driven RAN, core and edge integration to accelerate transition from 6G research to commercial deployment.

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03 {{ "2026-03-03T00:00:00+00:00" | date "MMM" }} '26

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Rohm Semiconductors News

ROHM Expands GaN Power Device Production

Licensing TSMC’s 650V GaN process technology enables in-house wafer fabrication at ROHM Hamamatsu, strengthening supply continuity for high-voltage AI server and EV power systems.

Read more…

03 {{ "2026-03-03T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-03T00:00:00+00:00" | date "longDate" }}

Qualcomm News

Release 19-Ready 5G Modem Targets 6G Evolution

Qualcomm Technologies introduces the X105 Modem-RF system with 3GPP Release 19 readiness, 6nm RF transceiver and integrated NR-NTN support for 5G Advanced devices.

Read more…

03 {{ "2026-03-03T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-03T00:00:00+00:00" | date "longDate" }}

Broadcom News

Telco Cloud Platform Targets AI and Sovereign Services

Broadcom unveils VMware Telco Cloud Platform 9 to improve hardware efficiency, reduce total cost of ownership and enable AI monetization in telecom data centers.

Read more…

03 {{ "2026-03-03T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-03T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

AI-Driven Uplink Optimization for Next-Generation RAN

Keysight Technologies and MediaTek demonstrate a prototype combining RAN-assisted AI, site-specific retraining and OTA model updates to improve uplink performance.

Read more…

02 {{ "2026-03-02T00:00:00+00:00" | date "MMM" }} '26

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e-con Systems News

Edge AI Vision Platforms for Multi-Camera Systems

e-con Systems presents edge AI and multi-camera vision technologies for robotics, mobility, and industrial applications at NVIDIA GTC 2026 and Embedded World 2026.

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02 {{ "2026-03-02T00:00:00+00:00" | date "MMM" }} '26

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Siemens digital Industry Software News

Siemens Adds Agentic AI to Chip Verification

New workflows automate RTL checks, debugging and planning while remaining compatible with existing EDA environments and cloud-based development infrastructures.

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02 {{ "2026-03-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-02T00:00:00+00:00" | date "longDate" }}

NEC Corporation News

NEC Enables Hybrid Cloud-Edge UPF Deployment

Support for AWS Outposts racks enables telecom operators to place 5G core processing where latency and traffic conditions require flexible infrastructure design.

Read more…

02 {{ "2026-03-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-02T00:00:00+00:00" | date "longDate" }}

Toshiba News

High-side ideal diode controller for automotive applications with reverse polarity protection

Toshiba Electronics Europe presents a compact high-side ideal diode controller for protected and redundant automotive power architecture.

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27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Seco News

Edge AI Platforms for Industrial Systems

SECO and Qualcomm Technologies combine Dragonwing platforms and Clea software to deploy scalable edge computing solutions for industrial automation, smart grid, and advanced HMI applications.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Ericsson and Intel Advance AI-Native 6G Collaboration

Partnership announced at MWC 2026 targets AI-driven RAN, core and edge integration to accelerate transition from 6G research to commercial deployment.

ROHM Expands GaN Power Device Production

Licensing TSMC’s 650V GaN process technology enables in-house wafer fabrication at ROHM Hamamatsu, strengthening supply continuity for high-voltage AI server and EV power systems.

Release 19-Ready 5G Modem Targets 6G Evolution

Qualcomm Technologies introduces the X105 Modem-RF system with 3GPP Release 19 readiness, 6nm RF transceiver and integrated NR-NTN support for 5G Advanced devices.

Telco Cloud Platform Targets AI and Sovereign Services

Broadcom unveils VMware Telco Cloud Platform 9 to improve hardware efficiency, reduce total cost of ownership and enable AI monetization in telecom data centers.

AI-Driven Uplink Optimization for Next-Generation RAN

Keysight Technologies and MediaTek demonstrate a prototype combining RAN-assisted AI, site-specific retraining and OTA model updates to improve uplink performance.

Edge AI Vision Platforms for Multi-Camera Systems

e-con Systems presents edge AI and multi-camera vision technologies for robotics, mobility, and industrial applications at NVIDIA GTC 2026 and Embedded World 2026.

Siemens Adds Agentic AI to Chip Verification

New workflows automate RTL checks, debugging and planning while remaining compatible with existing EDA environments and cloud-based development infrastructures.

NEC Enables Hybrid Cloud-Edge UPF Deployment

Support for AWS Outposts racks enables telecom operators to place 5G core processing where latency and traffic conditions require flexible infrastructure design.

High-side ideal diode controller for automotive applications with reverse polarity protection

Toshiba Electronics Europe presents a compact high-side ideal diode controller for protected and redundant automotive power architecture.

Edge AI Platforms for Industrial Systems

SECO and Qualcomm Technologies combine Dragonwing platforms and Clea software to deploy scalable edge computing solutions for industrial automation, smart grid, and advanced HMI applications.

International