Partnership with Qualcomm expands chipset integration across smartphones and connected devices to enhance performance, AI processing and system-level optimization.
At Embedded World 2026 , Anritsu Corporation demonstrated how IoT device manufacturers use RF and signal integrity testing to improve wireless reliability and reduce redesign risks.
Advanced RF, power consumption and high-speed signal-integrity solutions enable reliable IoT device validation from wireless connectivity to PCIe Gen6 compliance.
Melexis expands its automotive, industrial and robotics portfolio with new power protection, lighting control, inductive sensing and FIR-based people detection technologies.
Stackable point-of-load modules from TDK support high-current, low-voltage power architectures for AI servers, data centers, and edge computing platforms.