The new software module automates parameter extraction for compact device models, supporting DTCO workflows for advanced-node, RF and power semiconductors.
Rutronik adds JAE’s MY05 Series, built to IEC 60664-1 creepage/clearance requirements for high-voltage sensing and control in 800–1,000 V architectures.
Free STEP models with visualized field of view help engineers select and integrate S-mount optics for board-level cameras in industrial imaging systems.
Anritsu Company and Tektronix cooperate to integrate vector network analysis and oscilloscope-based compliance testing for standardized validation of Automotive Ethernet components.
The certification validates Innodisk’s secure development lifecycle across its full product portfolio, aligning its edge AI and industrial solutions with international cybersecurity and regulatory requirements.
New interdigital electrode chips enable parallel, high-precision material testing, accelerating development of organic electronic devices and sensor technologies.
Silicon Storage Technology and United Microelectronics Corporation qualify SuperFlash Gen 4 eNVM for safety-critical automotive controllers on UMC’s 28HPC+ process.